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Electro magnetic interference shielding characteristic of silver coated copper powder

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Abstract

The present investigation deals with the synthesis of silver coated copper powder for potential application as filler material in conductive polymers for electro magnetic interference (EMI) shielding. Copper powders were obtained by the reaction of cuprous oxide and, hydrazine in a mixed solvent (H2O:ethanol) at various reaction conditions. The cuprous oxide powder was produced by the reaction of CuSO4, NaOH and D-glucose. The synthesized copper powder was silver coated by its reaction with (NH4)2SO4, C4H4O6KNa and AgNO3. The prepared powders were characterized by XRD, SEM, TGA and XPS. The coaxial transmission line method was used to measure the EMI shielding effectiveness of the powders. The silver coated copper powders exhibited an improved oxidation resistance and higher EMI shielding effectiveness as compared to the uncoated copper powders.

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References

  1. J. A. Pomposo, J. Rodrigues, and H. Grande, Synthetic Met. 104, 107 (1999).

    Article  CAS  Google Scholar 

  2. C. Y. Huang and J. F. Pai, Eur. Polym. J. 34, 261 (1998).

    Article  CAS  Google Scholar 

  3. S. S. Tzeng and F. Y. Chang, Mater. Sci. Eng. A 302, 258 (2001).

    Article  Google Scholar 

  4. G. B. Cheng, Electron. Mater. Lett. 5, 201 (2009).

    Article  CAS  Google Scholar 

  5. C. Y. Huang and S. R. Sheen, Materials Letters, 30, 357–361(1997).

    Article  CAS  Google Scholar 

  6. X. Xu, X. Luo, H. Zhuang, W. Li, and B. Zhang, Mater. Lett. 57, 3987 (2003).

    Article  CAS  Google Scholar 

  7. S. Shukla, S. Seal, Z. Rahaman, and K. Scammon, Mater. Lett. 57, 151 (2002).

    Article  CAS  Google Scholar 

  8. B. Zhao, Z. Liu, Z. Zhang, and L. Hu, J. Solid State Chem. 130, 157 (1997).

    Article  CAS  Google Scholar 

  9. C. G. Lee, G. H. Kim, W. J. Lee, S. H. Kim, Y. J. Kim, C. Smith, and I. S. Kim, Met. Mater. Int. 14, 189 (2008).

    Article  CAS  Google Scholar 

  10. D. S. Bae, E. J. Kim, J. H. Bang, S. W. Kim, K. S. Han, J. K. Lee, B. I. Kim, and J. H. Adair, Met. Mater. Int. 11, 291 (2005).

    Article  CAS  Google Scholar 

  11. Y. C. Zhang, R. X. Xiao, and Y. Hu, J. Cryst. Growth 273, 280 (2004).

    Article  CAS  Google Scholar 

  12. J. Hernandez, P. Wrschka, and G. S. Oehrlein, J. Electro-Chem. Soc. 148, G389 (2001).

    Article  CAS  Google Scholar 

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Correspondence to Younghee Kim.

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Kim, J.J., Lee, H.W., Dabhade, V.V. et al. Electro magnetic interference shielding characteristic of silver coated copper powder. Met. Mater. Int. 16, 469–475 (2010). https://doi.org/10.1007/s12540-010-0619-1

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  • DOI: https://doi.org/10.1007/s12540-010-0619-1

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