1. MST Special Issue on the conference MicroNanoReliability 2007

   • Bernd Michel

   Editorial 28 August 2008 Pages: 1 - 1

2. Failure modeling of ACA-glued flip-chip on flex assemblies

   • B. Wunderle
   • C. Kallmayer
   • H. Reichl

   Technical Paper 25 September 2008 Pages: 3 - 15

   

3. A simple method for testing the electromigration resistance of solders

   • M. Saka
   • T. Kohara
   • M. Yamashita

   Technical Paper 06 June 2008 Pages: 17 - 25

   

4. Strength of hierarchical materials

   • Alberto Carpinteri
   • Pietro Cornetti
   • Alberto Sapora

   Technical Paper 12 June 2008 Pages: 27 - 31

   

5. Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramics

   • Shouwen Yu
   • Li Yu

   Technical Paper 10 August 2008 Pages: 33 - 38

   

6. Design limitations related to conductive anodic filament formation in a micro-world

   • Antonio Caputo
   • Laura J. Turbini
   • Doug D. Perovic

   Technical Paper 15 August 2008 Pages: 39 - 44

   

7. How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments

   • W. H. Müller
   • H. Worrack
   • A. Juritza

   Technical Paper 22 August 2008 Pages: 45 - 55

   

8. Interlayer cooling potential in vertically integrated packages

   • T. Brunschwiler
   • B. Michel
   • H. Reichl

   Technical Paper 21 August 2008 Pages: 57 - 74

   

9. Simulations of nanoscale thermal conduction

   • Pekka Heino

   Technical Paper 30 May 2008 Pages: 75 - 81

   

10. Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections

    • M. Dreßler
    • K-F. Becker
    • H. Reichl

    Technical Paper 12 August 2008 Pages: 83 - 88

    

11. Study on fault diagnostic strategy of intelligent magnetic detection microsystems

    • Yongqiang Wang
    • Wenzhong Lou
    • Dayin Zhang

    Technical Paper 06 September 2008 Pages: 89 - 94

    

12. Distributed BIT diagnostic network Microsystems for miniature mobile robot

    • Yu Xiuli
    • Lou Wenzhong
    • Wang Yongqiang

    Technical Paper 22 July 2008 Pages: 95 - 99

    

13. Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections

    • Zhiheng Huang
    • Paul P. Conway
    • Rongshan Qin

    Technical Paper Open access 29 April 2008 Pages: 101 - 107

    

14. Exploring the applicability of gradient elasticity to certain micro/nano reliability problems

    • Elias C. Aifantis

    Technical Paper 16 September 2008 Pages: 109 - 115

    

15. Nonsingular dislocation and crack fields: implications to small volumes

    • J. Kioseoglou
    • I. Konstantopoulos
    • E. C. Aifantis

    Technical Paper 17 September 2008 Pages: 117 - 121

    

16. Failure of electronic devices due to condensation

    • C. Schimpf
    • K. Feldmann
    • A. Steinke

    Technical Paper 06 June 2008 Pages: 123 - 127

    

17. Physics of failure for interconnect structures: an essay

    • Rainer Tilgner

    Technical Paper 08 May 2008 Pages: 129 - 138

    

18. Reliability testing of nano-particle system packaging

    • James E. Morris

    Technical Paper 03 July 2008 Pages: 139 - 143

    

19. Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards

    • J. Lee
    • C. S. Cho
    • J. E. Morris

    Technical Paper 23 July 2008 Pages: 145 - 149

    

20. Focused ion beam core hole drilling for stress detection in thin-films

    • H. Gerdes
    • H. H. Gatzen

    Technical Paper 11 June 2008 Pages: 151 - 153

    

21. Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performance

    • M. Shamshirsaz
    • M. Maroufi
    • M. Gheisarieha

    Technical Paper 27 May 2008 Pages: 155 - 159

    

22. Assessment of testing methodologies for thin-film vacuum MEMS packages

    • Qian Li
    • Hans Goosen
    • Guoqi Zhang

    Technical Paper Open access 03 July 2008 Pages: 161 - 168

    

23. Poly-si extensions and etching residues as a reliability risk

    • Peter Jacob

    Technical Paper 03 June 2008 Pages: 169 - 174

    

24. Macroscopic invisible cables

    • Nicola M. Pugno

    Technical Paper 17 July 2008 Pages: 175 - 180

    

25. TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads

    • Tomasz Fałat
    • Kazimierz Friedel
    • Stephan Warnat

    Technical Paper 05 June 2008 Pages: 181 - 190

    

26. A silicon test chip for the thermomechanical analysis of MEMS packagings

    • Soeren Majcherek
    • Thomas Leneke
    • Soeren Hirsch

    Technical Paper 21 June 2008 Pages: 191 - 200

    

27. Changes in the microstructure of materials and their impact on reliability: experiments and modeling

    • Andreas Brandmair
    • Thomas Böhme
    • Wolfgang H. Müller

    Technical Paper 05 August 2008 Pages: 201 - 215