1. Electrical characterization of integrated passive devices using thin film technology for 3D integration

   • Xin Sun
   • Yun-hui Zhu
   • Yu-feng Jin

   OriginalPaper 10 April 2013 Pages: 235 - 243

2. Low temperature Si/Si wafer direct bonding using a plasma activated method

   • Dong-ling Li
   • Zheng-guo Shang
   • Zhi-yu Wen

   OriginalPaper 10 April 2013 Pages: 244 - 251

3. A planar capacitive sensor for 2D long-range displacement measurement

   • Jian-ping Yu
   • Wen Wang
   • Zi-chen Chen

   OriginalPaper 10 April 2013 Pages: 252 - 257

4. Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology

   • Ji-jun Xiong
   • Shi-jun Zheng
   • Qiu-lin Tan

   OriginalPaper 10 April 2013 Pages: 258 - 263

5. High-precision low-power quartz tuning fork temperature sensor with optimized resonance excitation

   • Jun Xu
   • Xin Li
   • Hai-bo Xu

   OriginalPaper 10 April 2013 Pages: 264 - 273

6. A trapezoidal cantilever density sensor based on MEMS technology

   • Li-bo Zhao
   • Long-qi Xu
   • Zhuang-de Jiang

   OriginalPaper 10 April 2013 Pages: 274 - 278

7. High Q, high frequency, high overtone bulk acoustic resonator with ZnO films

   • Meng-wei Liu
   • Ming-bo Zhu
   • Cheng-hao Wang

   OriginalPaper 10 April 2013 Pages: 279 - 282

8. Resin-bonded NdFeB micromagnets for integration into electromagnetic vibration energy harvesters

   • Pei-hong Wang
   • Kai Tao
   • Gui-fu Ding

   OriginalPaper 10 April 2013 Pages: 283 - 287

9. Ka-band ultra low voltage miniature sub-harmonic resistive mixer with a new broadside coupled Marchand balun in 0.18-μm CMOS technology

   • Ge-liang Yang
   • Zhi-gong Wang
   • Zhu Li

   OriginalPaper 10 April 2013 Pages: 288 - 295

10. Predictive current control of multi-pulse flexible-topology thyristor AC-DC converter

    • Da-min Zhang
    • Shi-tao Wang
    • Zheng-yu Lu

    OriginalPaper 10 April 2013 Pages: 296 - 310