Editors
Alan Zehnder, Cornell University, USA (2025)
Technical EditorsMatthew S. Allen, Brigham Young University, USA (2025)
Michael Brünig, Universität der Bundeswehr München, Germany (2026)
Janice Barton, University of Bristol, UK (2025)
Vijay Chalivendra, University of Massachusetts, Dartmouth, USA (2025)
Weinong Chen, Purdue University, USA (2026)
Samantha Daly, University of California - Santa Barbara, USA (2025)
Maarten de Boer, Carnegie Mellon University, USA (2026)
Frank DelRio, Sandia National Laboratories, USA (2025)
Adrian DeWald, Hill Engineering, LLC, USA (2025)
Dario Di Maio, University of Twente in the Netherlands, Netherlands (2024)
Matthew Enloe, General Motors Materials Engineering, USA (2024)
Christian Franck, University of Wisconsin-Madison, USA (2025)
Martha E. Grady, University of Kentucky, USA (2026)
Shelby Hutchens, University of Illinois Urbana Champaign, USA (2025)
Krishna Jonnalagadda, Indian Institute of Technology Bombay, India (2025)
Michael Keller, The University of Tulsa, USA (2025)
Jamie Kimberley, New Mexico Institute of Mining and Technology, USA (2025)
John Kolinski, Institute of Mechanical Engineering, EPFL, Switzerland (2025)
Francesco Lanza di Scalea, University of California - San Diego, USA (2025)
Hongbing Lu, University of Texas at Dallas, USA (2026)
Michael Mello, California Institute of Technology, USA (2025)
Kunal Mishra, Corning Research and Development Center, USA (2025)
Garrett Pataky, Clemson University, USA (2025)
Julien Réthoré, Nantes Université, Ecole Centrale Nantes, CNRS, GeM, UMR 6183, France (2025)
Bojana Rosic, University of Twente, Netherlands (2025)
John Shaw, University of Michigan - Ann Arbor, USA (2024)
Junlan Wang, University of Washington, USA (2024)
Huimin Xie, Tsinghua University, People’s Republic of China (2026)
Luoyu (Roy) Xu, Ningbo University, China (2024)
Satoru Yoneyama, Aoyama Gakuin University, Japan (2024)
Hareesh Tippur, Chair, Auburn University, USA
Ghatu Subhash, Secretary, University of Florida, USA
Randall Allemang, University of Cincinnati, USA
Hugh Bruck, University of Maryland, USA
Isaac Daniel, Northwestern University, USA
Horacio Espinosa, Northwestern University, USA
C.T. Lim, National University of Singapore, Singapore
Timothy C. Miller, US Air Force Research Laboratory, USA
Parameswaran Venkitanarayanan, Indian Institute of Technology Kanpur, India
Eann Patterson, University of Liverpool, UK
Guruswami Ravichandran, Caltech, USA
Nancy Sottos, University of Illinois, USA
Xiaoping Wu, University of Science and Technology, China
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