Non-destructive evaluation of the interface between silicon dies and copper leadframes in integrated circuit packaging J. AbdulN. GuoK. C. Chan OriginalPaper Pages: 113 - 120
Mechanical testing of ultra-high temperature alloys R. VölklB. Fischer OriginalPaper Pages: 121 - 127
Design and evaluation of the poleidoscope: A novel digital polariscope J. LesniakS. J. ZhangE. A. Patterson OriginalPaper Pages: 128 - 135
A novel specimen for investigating the mechanical behavior of elastomers under multiaxial loading conditions W. V. MarsA. Fatemi OriginalPaper Pages: 136 - 146
Failure loads of spot weld specimens under impact opening and shear loading conditions S. -H. LinJ. PanT. Tyan OriginalPaper Pages: 147 - 157
Dynamic crack kinking from a PMMA/Homalite interface J. KimberleyJ. Lambros OriginalPaper Pages: 158 - 166
Dynamic force-penetration curves in rock by matching theoretical to experimental wave propagation response Luciano E. Chiang OriginalPaper Pages: 167 - 175
Laser surface-contouring and spline data-smoothing for residual stress measurement M. B. PrimeR. J. SebringP. J. Webster OriginalPaper Pages: 176 - 184
Analytical/experimental investigation of energy absorption in grid-stiffened composite structures under transverse loading C. GanR. F. GibsonG. M. Newaz OriginalPaper Pages: 185 - 194
Ball spin generation for oblique impacts with a tennis racket S. R. GoodwillS. J. Haake OriginalPaper Pages: 195 - 206
An experimental—Numerical evaluation of theT ε * integral for a three-dimensional crack front J. H. JacksonA. S. KobayashiS. N. Atluri OriginalPaper Pages: 207 - 213
Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling C. -H. ChienY. -C. ChenT. -P. Chen OriginalPaper Pages: 214 - 220