Editors
Editor-in-Chief:
John S. Popovics, The University of Illinois at Urbana-Champaign, Urbana, IL, USA
Advisory Board:
Leonard J. Bond, Iowa State University, Ames, IA, USA
Norbert Meyendorf, University of Dayton, Dayton, OH, USA
Editorial Board:
Dimitrios Aggelis, Vrije Universiteit Brussel, Brussels, Belgium
John C. Aldrin, Computational Tools, Gurnee, IL, USA
Mohamad Alipour, University of Illinoi Urbana-Champaign, Urbana, IL, USA
Sunil Kishore Chakrapani, Michigan State University, East Lansing, MI, USA
Anthony Croxford, University of Bristol, Bristol, UK
Nico F. Declercq, Georgia Institute of Technology, Atlanta, GA, USA
Feng Guo, Shandong University, Jinan, China
Stephen D. Holland, Iowa State University, Ames, IA, USA
Bin Hu, China Special Equipment Inspection and Research Institute, Beijing, China
Nathan Ida, University of Akron, Akron, OH, USA
Johann Kastner, University of Applied Science, Wels, Austria
Bernd Koehler, Fraunhofer IKTS, Dresden, Germany
Thomas Krause, Royal Military College of Canada, Kingston, ON, Canada
Claudia Kropas-Hughes, Air Force Life Cycle Management Center, Wright-Patterson Air Force Base, Dayton, OH, USA
Wallace Wai-Lok Lai, The Hong Kong Polytechnic University, Hong Kong
Alejandro Martinez-Rios, Centro de Investigaciones en Óptica, León, Mexico
Katie Matlack, The University of Illinois at Urbana-Champaign, Urbana, IL, USA
Ravibabu Mulaveesala, Indian Institute of Technology Delhi, Hauz Khas, New Delhi, India
Kazuyuki Nakahata, Ehime University, Matsuyama, Ehime, Japan
Ernst Niederleithinger, Bundesanstalt für Materialforschung und -prüfung, Berlin, Germany
Matthias Pelkner, Bundesanstalt für Materialforschung und -prüfung, Berlin, Germany
Rainer Schneider, Beuth University of Applied Sciences Berlin, Berlin, Germany
Thomas Schumacher, Portland State University, Portland, OR, USA
Gongtian Shen, China Special Equipment Inspection and Research Institute (CSEI), Beijing, China
Xianming Shi, Washington State University, Pullman, WA, USA
Tadeusz Stepinski, AGH - University of Science and Technology in Krakow, Krakow, Poland
Andreas Tewes, Beuth University for Applied Sciences, Berlin, Germany
Vladimir P. Vavilov, Tomsk Polytechnic University, Tomsk, Russia
Johannes Vrana, Vrana GmbH, Rimsting, Germany
Jinying Zhu, University of Nebraska-Lincoln, Omaha, NE, USA
Xuan “Peter” Zhu, University of Utah, Salt Lake City, UT, USA