Abstract
The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages. In recent years, several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys, such as SiCp/Al, SICp/Cu, diamond/Al and diamond/Cu. However, these materials with high content of reinforcements have not been widely used in packaging field because they are hard to be machined into complex-shaped parts due to their greater hardness and brittleness. So, it is necessary to explore a near-net shape forming technology for these composites. In this paper, a novel technology of powder injection molding-infiltration is introduced to realize the near-net shaped preparation of the composite packages with high thermal conductivity.
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Supported by the National Natural Science Foundation of China (Grant No. 50774005) and the Program for New Century Excellent Talents in University (Grant No. NCET-06-0081)
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He, X., Qu, X., Ren, S. et al. Net-shape forming of composite packages with high thermal conductivity. Sci. China Ser. E-Technol. Sci. 52, 238–242 (2009). https://doi.org/10.1007/s11431-008-0346-8
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DOI: https://doi.org/10.1007/s11431-008-0346-8