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The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-base superalloys

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Abstract

The dissolution of base metal into insert metal during TLP bonding of Ni base CMSX-2 superalloys, was studied. The effect of grain size on the dissolution phenomenon was also investigated. TLP bonding of single crystal, coarse grained and fine grained CMSX-2 specimens was carried out at 1373–1548 K for 019.6 ks under 2.3 MPa. During TLP bonding, the dissolution of the base metal into insert metal occurred very rapidly, leading to constant dissolution width at a given holding time. The dissolution width of the base metal broadened with increasing bonding temperature and holding time in all samples used. The dissolution of the base metal into the insert melt pool was governed by Nernst-Brunner’s theory in any grain size of base metal. The saturation time for dissolving base metal shortened, but its width broadened with increasing bonding temperature. The dissolution rate of the base metal increased with decreasing grain size of the base metals.

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Authors and Affiliations

  1. Central Research Institute, Hyundai Space and Aircraft Co., 8-2 Galhyun-ri, Seongyeon-myun, 356-850, Seosan, Korea

    Dae-Up Kim, Chung-Yun Kang & Won-Jae Lee

  2. Department of Metallurgical Engineering, Pusan National University, San 30 Changjeon-dong, Kumjeong-ku, 609-735, Pusan, Korea

    Chung-Yun Kang

  3. Pusan Branch/Korea Basic Science Institute, Pusan National University, San 30 Changjeon-dong, Kumjeong-ku, 609-735, Pusan, Korea

    Won-Jae Lee

Authors
  1. Dae-Up Kim
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  2. Chung-Yun Kang
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  3. Won-Jae Lee
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Kim, DU., Kang, CY. & Lee, WJ. The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-base superalloys. Metals and Materials 5, 477–484 (1999). https://doi.org/10.1007/BF03026162

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