Abstract
In order to predict the crack growth life in microelectronics solder joints, an FE A (finite element analysis) program employing a new scheme for crack growth analysis is developed. Also some experimental data necessary for the practical application of this program are obtained. Above all, the data related to the crack growth rate play a key role and are obtained in terms of the maximum opening stress range Δσθ max as
where α = 2.0 and β = 2.5 x 10-9 mm 5/N 2 are independent of the test conditions, and γ is dependent on the solder material. The calculated values of the crack growth life by the FEA are in good agreement with the experimental ones. This indicates at the same time that the crack growth rate and path are certainly controlled, through the above equation, by Δσθ max measured at a certain radial distance from the crack tip.
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References
Mukai M. Kawakami T. Endo T. and Takahashi K., “ Elastic-creep behavior and fatigue life in an IC package solder joint”, 4th Annual Meeting on Computational Mechanics, JSME, No.910-79, (1991), pp.223–224.
Lau J.H. Rice D.W. and Erasmus S., ”Thermal fatigue life of 256-Pin, 0.4mm pitch plastic quad flat pack(QFP) solder joint”, ASME Advances in Electronic Packaging 1992, EEP-Vol-2, (1992), pp.855–865.
Busso E.P. Kitano M. and Kumazawa T., ”Modeling complex inelastic deformation processes in IC packages solder joints”, ASME Journal of Electronic Packaging, Vol.116, (1994), pp.6–15.
Shiratori M. and Qiang Y., ”Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading”, Fifth Intersociety Conference on Thermal Phenomena in Electronic Systems, (1996), pp.151–157.
Taneda M. and Kaminishi K., ”Effect of cycling frequency on fatigue life of solder”, ASME Advances in Electronic Packaging 1992, EEP-Vol-1, (1992), pp.337–342.
Kaminishi K. lino M. and Taneda M., ” Evaluation of fatigue crack initiation and extension life in microelectronics solder joints of surface mount type”, JSME Int. J. Vol.42, No.2,(1999), pp.272–279.
Mavoori H. Chin J. Vayman S. Moran B. Keer L. and Fine M., ”Creep Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders”, Journal of Electronic Materials, Vol.26, No.7, (1997), pp.783–790.
Trumble B., ”Get the Lead Out”, IEEE Spectrum, Vol.35, No.5, (1998), pp.55–62.
Takemoto T. Takahasi M. Mtsunawa A. Ninomiya R. and Tai H., ”Tensile Deformation Behavior of Sn-Ag-Bi System Lead-Free Solders”, Journal of Japan Welding Society, Vol.16, No.1, (1998), pp.87–92.
Kariya Y. and Otsuka M., ”Mechanical Fatigue Charactristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder Alloy”, Journal of Electronic Materials, Vol.27, No.11, (1998), pp.1223–1228.
Taneda M. Oku Y. and Kaminishi K., ”A method for solder fatigue life prediction by strain-range partitioning approach”, Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol.58, No.549, A, (1992), pp.669–675.
Sloan S.W., ”An implementation of Watson’s algorithm for computing two-dimensional delaunay triangulations”, Advances in Engineering Software, Vol.6, (1984), pp.192–193.
Yagawa G. Kanto Y. and Ando Y., ”Analysis of dynamic contact problems using penalty function method”, Trans. Jpn. Soc. Mech. Eng., (in Japanese), Vol.49, No.448, A, (1983), pp.1581–1589.
lino M. Kaminishi K. and Taneda M., ”Fatigue crack nucleation and growth in microelectronics solder joints”, Proc. ASME Int. Intersociety Electronic Packaging Conf., EEP-19-2, (1997), pp.1575–1582.
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Kaminishi, K. (2002). Prediction of the Fatigue Crack Growth Life in Microelectronics Solder Joints. In: Babuška, I., Ciarlet, P.G., Miyoshi, T. (eds) Mathematical Modeling and Numerical Simulation in Continuum Mechanics. Lecture Notes in Computational Science and Engineering, vol 19. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-56288-4_3
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DOI: https://doi.org/10.1007/978-3-642-56288-4_3
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