Abstract
The present investigation is an attempt to develop metal-intermetallic laminate composites based on Ni-Al system. In this study, Ni sheets and Al foils have been used for the development of Ni-Al laminate using accumulative roll-bonding technique at 773 K. The laminate composites were then subjected to the controlled annealing to affect reactive diffusion at the Ni/Al interface leading to intermetallic compound formation. The accumulative roll-bonded laminates showed good bonding of layers. Annealing treatment at 773 K led to formation of reaction product and maintained the interface integrity. A qualitative compositional analysis at the interfaces reflected the formation of Al-Ni compounds, and a gradual compositional gradient also across the interface. This process seems to be of promise so far as the continuous production of large scale metal-intermetallic laminate composites is concerned.
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References
K. Mizuuchi, K. Inoue, M. Sugioka, M. Itami, J.H. Lee, and M. Kawahara, Properties of Ni-Aluminides-Reinforced Ni-Matrix Laminates Synthesized by Pulsed-Current Hot Pressing (PCHP), Mater. Sci. Eng. A, 2006, 428, p 169–174
K.S. Vecchio, Synthetic Multifunctional Metallic-Intermetallic Laminate Composites, JOM, 2005, 57(3), p 25–29
S. Kobayashi and T. Yakou, Control of Intermetallic Compound Layers at Interface Between Steel and Aluminum by Diffusion-Treatment, Mater. Sci. Eng. A, 2002, 338, p 44–53
A. Rohatagi, D.J. Harach, K.S. Vecchio, and K.P. Harvey, Resistance-Curve and Fracture Behavior of Ti-Al3Ti Metallic-Intermetallic Laminate (MIL) Composites, Acta Mater., 2003, 51, p 2933–2957
H.Y. Kim, D.S. Chung, and S.H. Hong, Reaction Synthesis and Microstructures of NiAl/Ni Micro-Laminated Composites, Mater. Sci. Eng. A, 2005, 396, p 376–384
V. Jindal, V.C. Srivastava, A. Das, and R.N. Ghosh, Reactive Diffusion in the Roll Bonded Iron-Aluminum System, Mater. Lett., 2006, 60, p 1758–1761
V. Jindal, V.C. Srivastava, and R.N. Ghosh, Development of IF Steel-Al Multilayer Composite by Repetitive Roll Bonding and Annealing Process, Mater. Sci. Technol., 2008, 24, p 798–802
L.M. Peng, J.H. Wang, H. Li, J.H. Zhao, and L.H. He, Synthesis and Microstructural Characterization of Ti-Al3Ti Metal-Intermetallic Laminate (MIL) Composites, Scripta Mater., 2005, 52, p 243–248
X.K. Peng, R. Wuhrer, G. Henness, and W.Y. Yeung, On the Interface Development and Fracture Behaviour of Roll Bonded Copper/Aluminium Metal Laminates, J. Mater. Sci., 1999, 34, p 2029–2038
H.S. Ding, J.S. Lee, B.R. Lee, S.B. Kang, and T.H. Nam, Processing and Microstructure of TiNi SMA Strips Prepared by Cold Roll-Bonding and Annealing of Multilayer, Mater. Sci. Eng. A, 2005, 408, p 182–189
X. Ren, G.Q. Chen, W.L. Zhou, C.W. Wu, and J.S. Zhang, Effect of High Magnetic Field on Intermetallic Phase Growth in Ni-Al Diffusion Couples, J. Alloys Compd., 2009, 472, p 525–529
N. Tsuji, Y. Saito, S.H. Lee, and H. Minamino, ARB (Accumulative Roll-Bonding) and Other New Techniques to Produce Bulk Ultrafine Grained Materials, Adv. Eng. Mater., 2003, 5, p 338–344
H. Okamoto, Al-Ni (Aluminum-Nickel), J. Phase Equilb. Diff., 2004, 25, p 394
R. Pretorius, Prediction of Silicide First Phase and Phase Sequence from Heats of Formation, Mater. Res. Soc. Proc., 1984, 25, p 15–20
R. Pretorius, T.K. Marais, and C.C. Theron, Thin Film Compound Phase Formation Sequence: An Effective Heat of Formation Model, Mater. Sci. Rep., 1993, 10(1–2), p 1–83
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Srivastava, V.C., Singh, T., Ghosh Chowdhury, S. et al. Microstructural Characteristics of Accumulative Roll-Bonded Ni-Al-Based Metal-Intermetallic Laminate Composite. J. of Materi Eng and Perform 21, 1912–1918 (2012). https://doi.org/10.1007/s11665-011-0114-y
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DOI: https://doi.org/10.1007/s11665-011-0114-y