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Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

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Abstract

The thermal resistance of Si/Sn-52In/Cu sandwiched samples was measured by the laser flash method after various stages of thermal cycling. The thermal resistance was found to increase with increasing thermal cycles after 120 cycles. Cross-sections of the samples were examined by scanning electron microscopy. Cracks were observed in both the solder bulk and the interface between the intermetallic compound and solder. The increase of the thermal resistance was related to widening of the crack segments that were inclined to the interface.

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Acknowledgements

This work was supported by the National Basic Research Program of China (Grant No. 2004CB619306) and the National Natural Science Foundation of China (Grant No. 50706057). Special thanks are due to John and Jill for improvement of the English.

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    H.Y. Guo, J.D. Guo & J.K. Shang

  2. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, 61801, IL, USA

    J.K. Shang

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  1. H.Y. Guo
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  2. J.D. Guo
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  3. J.K. Shang
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Correspondence to J.D. Guo.

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Guo, H., Guo, J. & Shang, J. Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces. J. Electron. Mater. 38, 2470–2478 (2009). https://doi.org/10.1007/s11664-009-0857-5

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  • DOI: https://doi.org/10.1007/s11664-009-0857-5

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