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Sub-micrometer Network Fabrication for Bacterial Carriers and Electrical Signal Transmission

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Nano-Net (NanoNet 2009)

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Abstract

A compact platform for producing sub-micrometer 3D interconnects and networks for bacterial carriers and electrical signal transmission is briefly presented. The platform is composed of a dispensing system using polyurethane doped with silver nanoparticles, curing system controlling the polymerization process by emitting UV light, and an annealing system which is used to remove the cured resin and sinter the silver nanoparticles to reach suitable resistivity. We also add a video microscope to help the optimization of the process.

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References

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Author information

Authors and Affiliations

  1. Laboratoire de NanoRobotique, École Polytechnique de Montréal, Québec, Canada

    Gaël Bringout, Sajjad Saeidlou & Sylvain Martel

Authors
  1. Gaël Bringout
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  2. Sajjad Saeidlou
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  3. Sylvain Martel
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Editor information

Editors and Affiliations

  1. Microelectronic Systems Laboratory STI-LSM, Swiss Federal Institute of Technology EPFL, ELD339 Btiment ELD, Station 11, 1015, Lausanne, Switzerland

    Alexandre Schmid

  2. Business Administration, State University of New York,, 310b, 1400 Washington Ave.,, 12222, Albany, NY, USA

    Sanjay Goel

  3. College of Nanoscale Science and Engineering, University of Albany, 12222, Albany, NY, USA

    Wei Wang

  4. College of Information Technology, UAE University, P.O. Box 17555, Al Ain, Abu Dhabi, United Arab Emirates

    Valeriu Beiu

  5. Lausanne EPFL IC ISIM LSI1 INF 333 (Btment INF) Station 14, Swiss Federal Institute of Technology, CH-1015, Lausanne, Switzerland

    Sandro Carrara

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© 2009 ICST Institute for Computer Science, Social Informatics and Telecommunications Engineering

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Bringout, G., Saeidlou, S., Martel, S. (2009). Sub-micrometer Network Fabrication for Bacterial Carriers and Electrical Signal Transmission. In: Schmid, A., Goel, S., Wang, W., Beiu, V., Carrara, S. (eds) Nano-Net. NanoNet 2009. Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, vol 20. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-04850-0_7

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  • DOI: https://doi.org/10.1007/978-3-642-04850-0_7

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-04849-4

  • Online ISBN: 978-3-642-04850-0

  • eBook Packages: Computer ScienceComputer Science (R0)

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