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Experimental Study on Fatigue Crack Propagation Behavior at Composite

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Book cover Green and Smart Technology with Sensor Applications (ICTSM 2011, SIA 2012, GST 2012)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 338))

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Abstract

This study investigates the behavior of a fatigue crack propagating between holes or particles at composites. These inhomogeneities are found to play a significant role on the fatigue propagation behavior. This study is performed experimentally. When holes or the holes bonded with another materials exist near center crack symmetrically, crack propagation rate is influenced by the bonding force of the brazing part and the elastic modulus ratio of another material.

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Author information

Authors and Affiliations

  1. Div. of Mechanical & Automotive Engineering, Kongju National University, 1223-24 Cheonan Daero, Seobuk-gu, Cheonan-si, Chungnam, 331-717, Republic of Korea

    Jae-Ung Cho

  2. Dept. of Metal Mold Design Engineering College of Engineering, Kongju National University, 1223-24 Cheonan Daero, Seobuk-gu, Cheonan-si, Chungnam, 331-717, Republic of Korea

    Sei-Hwan Kim

Authors
  1. Jae-Ung Cho
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  2. Sei-Hwan Kim
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Editor information

Editors and Affiliations

  1. Chungwoon University, 350-701, Chungnam, Republic of Korea

    Hyun-seob Cho  & Keun-Wang Lee  & 

  2. GVSA and University of Tasmania, 20 Virginia Court, Hobart, TAS, Australia

    Tai-hoon Kim

  3. Lakehead University, ATAC 5013, 955 Oliver Road, P7B 5E1, Thunder Bay, Ontario, Canada

    Sabah Mohammed

  4. The Ohio State University, 4198 Graves Hall 333 W. 10th Avenue, 43210, Columbus, OH, USA

    Hojjat Adeli

  5. Hyejeon University, Hongseong-eup, Hongseong-gun, Chungnam-do, Republic of Korea

    Myoung-kwan Oh

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© 2012 Springer-Verlag Berlin Heidelberg

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Cho, JU., Kim, SH. (2012). Experimental Study on Fatigue Crack Propagation Behavior at Composite. In: Cho, Hs., Kim, Th., Mohammed, S., Adeli, H., Oh, Mk., Lee, KW. (eds) Green and Smart Technology with Sensor Applications. ICTSM SIA GST 2011 2012 2012. Communications in Computer and Information Science, vol 338. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35251-5_6

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  • DOI: https://doi.org/10.1007/978-3-642-35251-5_6

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-35250-8

  • Online ISBN: 978-3-642-35251-5

  • eBook Packages: Computer ScienceComputer Science (R0)

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