Abstract
Chitin is biocompatible and biodegradable, with antimicrobial activity and low immunogenicity, and the second most abundant biopolymer after cellulose. It is one of the necessary components of the formation of nacre/shell. So harnessing behavior of chitin not only would lead to mimics of these structures but also to potential applications in academic research and industry. A peptide induces a unique chitin-based gel formation. Then, in the presence of CaCO3 a flexible structure was obtained. This structure and complex has many potential applications for different applications such as development of bioinspired instruments, or complexes, nanotechnology etc. It is early step toward mimicking the structure of nacre/shell.
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References
Drury, J.L., Mooney, D.J.: Hydrogels for tissue engineering: Scaffold design variables and applications. Biomaterials 24, 4337–4351 (2003)
Pillai, C.K.S., Paul, W., et al.: Chitin and chitosan polymers: Chemistry, solubility and fiber formation. Progress in Polymer Science 34, 641–678 (2009)
Raabe, D., Romano, P., et al.: Microstructure and crystallographic texture of the chitin–protein network in the biological composite material of the exoskeleton of the lobster Homarus americanus. Materials Science and Engineering A 421, 143–153 (2006)
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© 2012 ICST Institute for Computer Science, Social Informatics and Telecommunications Engineering
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Khoushab, F., Yamabhai, M., Haller, K.J. (2012). Biomimicking the Formation of Nacre/Shell: One Step Forward. In: Suzuki, J., Nakano, T. (eds) Bio-Inspired Models of Network, Information, and Computing Systems. BIONETICS 2010. Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, vol 87. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-32615-8_8
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DOI: https://doi.org/10.1007/978-3-642-32615-8_8
Publisher Name: Springer, Berlin, Heidelberg
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