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A Packet Reassembly and Segmentation Protocol for Low Rate Applications in Bluetooth Sniff Mode

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Book cover Mobile Wireless Middleware, Operating Systems, and Applications (MOBILWARE 2011)

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Abstract

In this paper, a Packets Reassembly and Segmentation (PRAS) protocol is proposed, to be used in conjunction with the Bluetooth sniff mode, to re-assemble small host controller interface (HCI) (ACL) data packets to larger ones so that the link controller can use a larger baseband packet type (e.g. 3-DH5) as appropriate. The associated Bluetooth operations and control procedures of the PRAS protocol are given. The analysis shows that this protocol reduces Bluetooth’s use of small size baseband packets and significantly enhances packet transmission efficiency with lower overhead in Bluetooth sniff mode.

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References

  1. Bluetooth SIG.: Specification of the Bluetooth system, Version 4.0. (2010)

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Author information

Authors and Affiliations

  1. Department of Electronic and Computer Engineering, University of Limerick, Limerick, Ireland

    Jiangchuan Wen & John Nelson

Authors
  1. Jiangchuan Wen
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  2. John Nelson
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Editor information

Editors and Affiliations

  1. Department of Computer Sience, University of California, 2086 Donald Bren Hall, 92697-3435, Irvine, CA, USA

    Nalini Venkatasubramanian

  2. School of Electronics and Computer Science, University of Westminster, 115 New Cavendish Street, W1W 6UW, London, UK

    Vladimir Getov

  3. Fraunhofer FOKUS, Kaiserin-Augusta-Allee 31, 10589, Berlin, Germany

    Stephan Steglich

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© 2012 ICST Institute for Computer Science, Social Informatics and Telecommunications Engineering

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Wen, J., Nelson, J. (2012). A Packet Reassembly and Segmentation Protocol for Low Rate Applications in Bluetooth Sniff Mode. In: Venkatasubramanian, N., Getov, V., Steglich, S. (eds) Mobile Wireless Middleware, Operating Systems, and Applications. MOBILWARE 2011. Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, vol 93. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-30607-5_11

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  • DOI: https://doi.org/10.1007/978-3-642-30607-5_11

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-30606-8

  • Online ISBN: 978-3-642-30607-5

  • eBook Packages: Computer ScienceComputer Science (R0)

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