Abstract
Phenolic foam is a unique cellular material that can be utilized in either a fully open cell structure or a completely closed cell structure in a diversity of applications such as open cellular material for floral foam, soil propagation media and/or orthopedic use, and closed cell phenolic foam primarily for thermal insulation. Thus, phenolic foam is much more versatile than other competitive organic foams such as polystyrene and polyurethane with the latter materials being more heavily involved in thermal insulation. Foam processing can consider batch, semi-continuous, or continuous conditions, and the features and weaknesses of the appropriate processes are discussed along with continuous mix heads involving high and low pressure conditions.
The use of phenolic foam for thermal insulation is quite active in Europe, particularly in the UK, and is being revisited in North America because of the efforts of a program sponsored by the US Department of Energy leading to proposed neutral pH foam and improved mechanical strength/performance. The latter is accomplished by the introduction of small amounts of chopped cellulose fibers into the resole resin prior to foaming.
New foam areas are described and include the use of foam for air filtration for dust control, carbon foam prepared by carbonization of phenolic foam and then used for high temperature structural composite sandwich panels or for composite tooling, and pultruded phenolic foam. The latter offers an interesting opportunity as a means of preparing sandwich structures continuously by foaming/pultruding between phenolic glass and carbon fiber prepreg face sheets. In a related matter, fiber reinforced pultruded phenolic foam is being developed to possibly replace balsa core currently used by the US Navy in naval ship sandwich panel structures.
Different test methods are described such as fire testing, insulation efficiency, strength testing, and open/closed cell content. Saturation properties determination for floral foam is detailed.
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Dr. Jan Kosny, ORNL, Clearwater, FL Private Communication May 26, 2009.<?xml:namespace prefix = o ns = “urn:schemas-microsoft-com:office:office” />
Coppock V et al, awarded to Kingspan (2007) WO/2007/029221. Uncertain regarding Kazak Composites foaming conditions
‘A Burning Issue’ – paper presented by S. Long at the global insulation conference, 2007
‘Global Insulation – Materials, Companies, Markets and Trends’ paper presented by Dr. Nino Mancino at the global insulation conference, 2007
Yun MS and Lee WI (2004) SAMPE ISSE, Long Beach, CA p. 1649
Ben G and Shoji A (20030 Report of research Institute of Industrial Technology, Nihon University, number 69, 1–12
Ben G, Shoji A, Sonma M (2005) Sandwich Structure 7: Advancing with Sandwich structures and Materials. Proceedings of the 7th International Conference on Sandwich Structures, Aalborg University, Aalborg, Denmark, 29–31 August 2005
Schematics taken from sales literature published by Cannon Viking Ltd. and reproduced with kind permission of that company
Data published by Solvay Fluor GmbH in blowing agent sales literature and reproduced with kind permission of that company
World patent WO2006/067775A1 ‘Toughened Phenolic Foam’, Kingspan Holdings Ltd, Coppock. V
‘Closite Clay Infused Phenolic Foam Nanocomposite’, Vijaya K. Rangari, Tarig A.Hassan, Yuanxin Zhou, Hassan Mahfuz and Shaik Jeelani, Journal of Applied Polymer Science, 2006
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Cornick, M. (2010). Foam. In: Pilato, L. (eds) Phenolic Resins: A Century of Progress. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-04714-5_9
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DOI: https://doi.org/10.1007/978-3-642-04714-5_9
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