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Automated AFM as an Industrial Process Metrology Tool for Nanoelectronic Manufacturing

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Book cover Applied Scanning Probe Methods X

Part of the book series: Nano Science and Technolgy ((NANO))

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Abstract

Scanning probe microscope (SPM) techniques, invented 20 years ago, act as eyes for nanotechnology and nanoscience research and development, for imaging and characterizing surface topography and properties at atomic resolution. Particularly for the past decade, atomic force microscopy (AFM, one member of the SPM family) has evolved from laboratory research instrumentation to an industry metrology tool for geometric dimension control in nanoelectronic device manufacturing on production floors. This chapter gives an overview in great technical detail of state-of-the-art AFM applications in process characterization and inline monitoring for semiconductor manufacturing. Use of AFM equally applies for topography, dimension, and sidewall shape metrology in photomask and hard disk recording head processing.

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Author information

Authors and Affiliations

  1. Veeco Instruments Inc, 14990 Blakehill Dr, 75035, Frisco, TX , USA

    Tianming Bao

  2. Veeco Instruments Inc, 112 Robin Hill Rd, 93117, Santa Barbara, CA, USA

    David Fong & Sean Hand

Authors
  1. Tianming Bao
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  2. David Fong
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  3. Sean Hand
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Editor information

Editors and Affiliations

  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS (NLIM), The Ohio State University, 201W. 19th Avenue, 43210-1142, Columbus, Ohio , USA

    Bharat Bhushan

  2. Advanced Institute of Science & Technology, School of Materials Science, 923-1292, Ishikawa, Japan

    Masahiko Tomitori

  3. Institute of Physics, FB 16, University of Münster, Wilhelm-Klemm-Str. 10, 48149, Münster, Germany

    Harald Fuchs

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© 2008 Springer-Verlag Berlin Heidelberg

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Bao, T., Fong, D., Hand, S. (2008). Automated AFM as an Industrial Process Metrology Tool for Nanoelectronic Manufacturing. In: Bhushan, B., Tomitori, M., Fuchs, H. (eds) Applied Scanning Probe Methods X. Nano Science and Technolgy. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-74085-8_12

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