Summary
The results are overviewed of an ESR analysis in combination with an electrical capacitance—voltage and conductance—voltage study of point defects and traps in (100) Ge/GeO x N y /HfO2 and (100)Ge/GeO2 structures. Comparative study suggests drastic differences in the interface defect properties of the (100)Ge/GeO x N y /HfO2 and (100)Ge/GeO2 interfaces from the seemingly isomorphic interfaces of (100)Si with the HfO2 and SiO2. ESR fails to detect dangling bond centers associated with Ge crystal surface atoms — only paramagnetic defects in the near-interfacial Ge oxide or Ge (oxy) nitride layers are observed which show no correlation with the major portion of electrically active traps; their atomic nature remains unknown. In contrast with the amphoteric traps related to the dangling bonds (P b -type centers) commonly observed at the silicon/insulator interfaces, the major component of the Ge/insulator interface trap spectrum comes from slow acceptor states which show no immediate correlation with the observed paramagnetic centers. The influence of thermal passivation in H2 is addressed as well.
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Stesmans, A., Afanas’ev, V.V. (2007). Point Defects in Stacks of High-κ Metal Oxides on Ge: Contrast with the Si Case. In: Dimoulas, A., Gusev, E., McIntyre, P.C., Heyns, M. (eds) Advanced Gate Stacks for High-Mobility Semiconductors. Advanced Microelectronics, vol 27. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-71491-0_9
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