Abstract
Thin copper films have been deposited on Kapton® and silicon substrates by reducing films of copper formate in a hydrogen RF discharge. Auger electron spectroscopy (AES) analysis and X-ray diffractometry (XRD) have been used to characterize the films. The oxygen content of the as-deposited copper films has been reduced to about 1% by annealing in a hydrogen ambient at about 300°C. However, only the upper 20–25 nm thick surface layers of the films were found to be rich (>90%) in copper. The remainder of the film was contaminated with carbon and traces of iron. Process conditions that may minimize the carbon content in the bulk of the film are discussed. A new laser ablation technique appears to be more promising.
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© 1991 Springer Science+Business Media New York
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Padiyath, R., David, M., Babu, S.V. (1991). Plasma Induced Deposition of Copper Films on Polymer Surfaces. In: Mittal, K.L. (eds) Metallized Plastics 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0735-6_8
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DOI: https://doi.org/10.1007/978-1-4899-0735-6_8
Publisher Name: Springer, Boston, MA
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