Erratum to: Chapter 3 in: K. Kondo et al. (eds.), Copper Electrodeposition for Nanofabrication of Electronics Devices, DOI 10.1007/978-1-4614-9176-7_3

The material at the end of Chapter 3 (text on pages 56, 57, and top of 58 at the end of section 3.4) should not be regarded as part of the chapter and was inserted without the knowledge or consent of the author.