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Concerns and Solutions

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Book cover Copper Wire Bonding

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Abstract

This chapter provides an overview of the concerns with Cu wire bonding and the industry’s solutions to these concerns. Although Cu wire bonding is gaining widespread acceptance in the industry, there are a few challenges associated with it that need to be overcome. Cu wire bonding poses concerns related to Cu’s hardness, propensity to oxidize, and sensitivity to corrosion, as well as the wire bonding process, bonding in specialized packages, and low yield. The industry solutions to these problems, such as the use of thicker Al pads than are used in Au wire bonding, Ni-based pad finishes, specialized capillaries, palladium-coated Cu wires, and bonding in an inert gas atmosphere, are also discussed.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, USA

    Preeti S. Chauhan & Michael G. Pecht

  2. Industry Consultant, Marlborough, MA, USA

    Anupam Choubey

  3. School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore

    ZhaoWei Zhong

Authors
  1. Preeti S. Chauhan
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  2. Anupam Choubey
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  3. ZhaoWei Zhong
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  4. Michael G. Pecht
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Concerns and Solutions. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_8

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  • DOI: https://doi.org/10.1007/978-1-4614-5761-9_8

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