Abstract
This chapter discusses the evaluation of wire bonding performance. The criteria for good bonds are described, along with pre- and post-bonding inspection techniques. Wire bond functionality tests, such as bond accuracy tests, electrical resistance measurements, and material characterization of wire bonds, are covered. Destructive and nondestructive mechanical tests, shear tests, and pull tests to evaluate the wire bond strength are discussed. The industry standards and best practices for wire bonding quality assurance and testing methods, and the common reliability tests for wire bonds, are also explained.
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Wire Bond Evaluation. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_4
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DOI: https://doi.org/10.1007/978-1-4614-5761-9_4
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