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Copper Wire Bonding

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Copper Wire Bonding

Abstract

Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over Au, such as lower cost, higher mechanical strength, and higher electrical and thermal conductivity, are discussed. The chapter describes the adoption of Cu wire bonding in the semiconductor industry, as well as future projections for its usage.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, USA

    Preeti S. Chauhan & Michael G. Pecht

  2. Industry Consultant, Marlborough, MA, USA

    Anupam Choubey

  3. School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore

    ZhaoWei Zhong

Authors
  1. Preeti S. Chauhan
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  2. Anupam Choubey
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  3. ZhaoWei Zhong
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  4. Michael G. Pecht
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Copper Wire Bonding. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_1

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  • DOI: https://doi.org/10.1007/978-1-4614-5761-9_1

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-5760-2

  • Online ISBN: 978-1-4614-5761-9

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