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Recent Advances in Holographic Strain and Stress Measurement

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Imaging Methods for Novel Materials and Challenging Applications, Volume 3

Abstract

Holography allows the capture and reconstruction of whole wave fields with intensity and phase. The interferometric comparison of holographically reconstructed wave fields enables high-precision deformation measurements of diffusely reflecting surfaces, which has a lot of applications in experimental strain and stress analysis as well as in nondestructive testing. Digital holography gives the user the chance to decide during the reconstruction process, which plane he wants to focus. Here we show digital holography applied in microscopy, in particle analysis, in deformation measurements, and in the measurement of refractive index distributions of optical fibers. Recently spatial light modulators have been introduced to holography, thus varying the reference wave without mechanical movement of components. Here we present spatial light modulators used in digital shearography as well as in a flexible lensless Fourier-transform holography system together with measurement results obtained with these concepts.

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Acknowledgements

The research was funded partly by the European Communities Seventh Framework Programme FP7/2007-2013, grant 216105 (project REAL3D) as well as in the Network of Excellence 3DTV, grant 511568 in FP6 and partly by the Deutsche Forschungsgemeinschaft, grant Kr953/28-1, which is gratefully acknowledged.

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Correspondence to Thomas Kreis .

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© 2013 The Society for Experimental Mechanics, Inc.

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Kreis, T. (2013). Recent Advances in Holographic Strain and Stress Measurement. In: Jin, H., Sciammarella, C., Furlong, C., Yoshida, S. (eds) Imaging Methods for Novel Materials and Challenging Applications, Volume 3. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-4235-6_3

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  • DOI: https://doi.org/10.1007/978-1-4614-4235-6_3

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-4234-9

  • Online ISBN: 978-1-4614-4235-6

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