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Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies

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Advanced Thermal Management Materials

Abstract

In this chapter, we will first present the properties of WCu, MoCu, and Cu/MoCu/Cu high-performance heat sink materials in great detail. Then we will introduce manufacturing technologies such as high-temperature liquid-phase sintering, reactive sintering, and infiltration. Then we will introduce CMC/CPC composite manufacturing technologies such as hot rolling lamination, explosive forming, and laser cladding. Finally, we will discuss the WCu and MoCu microelectronics packaging material manufacturing technologies research diagram and present detailed descriptions of each step.

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Author information

Authors and Affiliations

  1. College of Materials Science and Engineering, Central South University, Changsha, Hunan, China

    Guosheng Jiang

  2. Brewer Science, Springfield, MO, USA

    Liyong Diao

  3. Torrey Hills Technologies, San Diego, CA, USA

    Ken Kuang

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  1. Guosheng Jiang
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  2. Liyong Diao
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  3. Ken Kuang
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Correspondence to Guosheng Jiang .

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Jiang, G., Diao, L., Kuang, K. (2013). Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies. In: Advanced Thermal Management Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-1963-1_5

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  • DOI: https://doi.org/10.1007/978-1-4614-1963-1_5

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