Future Trend of Advanced Thermal Management Materials

Abstract

The R&D work in advanced thermal management materials is active and ongoing. It is difficult to cover all related research results. In this chapter, we select a few common materials used in microelectronics packaging to review future trends. While most material is typically of a homogeneous structure, Cu/Mo70Cu/Cu is not. As discussed in an earlier chapter, this material (typically at 1:4:1 ratio) has a coefficient of thermal expansion in the X-direction of 7.2 ppm/°C and 9.0 ppm/°C. It was used successfully for long and this die attaches such as laterally diffused metal-oxide semiconductor. Within the realm of composite materials, carbon nanotubes and aluminum matrix composite materials (with graphite or SiC) have attracted a lot of interest due to their potential thermal properties. Lastly, the development of an injection moldable polymer is also reviewed.