Abstract
Many fields of study require deformation measurements of tiny specimens or tiny regions of larger specimens. The mechanics of microelectronic assemblies is an example, where the ever increasing demand for closer packing exacerbates the problems of thermal stresses. Other fields include crack-tip analyses in fracture mechanics; grain and intragranular deformations of metals and ceramics; interface problems; etc. Moiré interferometry adapted for such micromechanics studies is the subject of this chapter.
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© 1994 Springer-Verlag New York, Inc.
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Post, D., Han, B., Ifju, P. (1994). Microscopic Moiré Interferometry: Very High Sensitivity. In: High Sensitivity Moiré. Mechanical Engineering Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4612-4334-2_5
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DOI: https://doi.org/10.1007/978-1-4612-4334-2_5
Publisher Name: Springer, New York, NY
Print ISBN: 978-0-387-98220-5
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