Abstract
In this work, cylindrical inclusions of two different elastic moduli – stiff and compliant relative to the matrix – are examined. The former is a borosilicate glass inclusion whereas the latter is a polyurethane inclusion in an epoxy matrix. The 2D digital image correlation (DIC) technique along with high-speed photography is used to study crack growth behavior as a function of inclusion-matrix interfacial strength and the inclusion location relative to the crack under stress wave loading conditions. An ultra high-speed rotating mirror-type CCD digital camera is used to record random speckle patterns in the crack-inclusion vicinity at rates ranging from 150,000 to 300,000 frames per second. Two sets of images, one set before loading and another set during the fracture events are recorded. The crack tip deformation histories from the time of impact until complete fracture are mapped and fracture parameters are extracted. Different crack propagation patterns in terms of crack speed, crack path and stress intensity factor histories are observed followed by a macroscopic examination of fractured surfaces.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Kinloch AJ et al (1983) Deformation and fracture behavior of a rubber-toughened epoxy: 1. Microstructure and fracture studies Polymer 24(10):1341–1354
Kinloch AJ, Yuen ML, Jenkins SD (1994) Thermoplastic-toughened epoxy polymers. Journal of Materials Science 29(14):3781–3790
Evans AG, Williams S, Beaumont PWR (1985) On the toughness of particulate filled polymers. Journal of Materials Science 20(10):3668–3674
Geisler B, Kelley FN (1994) Rubbery and rigid particle toughening of epoxy-resins. Journal of Applied Polymer Science 54(2):177–189
Hussain M et al (1996) Fracture behavior and fracture toughness of particulate filled epoxy composites. Materials Letters 27(1–2):21–25
Tamate O (1968) Effect of a circular inclusion on stresses around a line crack in a sheet under tension. International Journal of Fracture Mechanics 4(3):257–266
Erdogan F, Gupta GD, Ratwani M (1974) Interaction between a circular inclusion and an arbitrarily oriented crack. Journal of Applied Mechanics-Transactions of the Asme 41(4):1007–1013
Bush MB (1998) The interaction between a crack and a particle cluster. International Journal of Fracture 88(3):215–232
Kitey R et al (2006) Modeling of crack growth through particulate clusters in brittle matrix by symmetric-Galerkin boundary element method. International Journal of Fracture 141(1–2):11–25
Savalia PC, Tippur HV, Kirugulige MS (2008) A numerical study of inclusion-matrix debonding in the presence of a nearby crack. Engineering Fracture Mechanics 75(5):926–942
O'Toole BJ, Santare MH (1990) Photoelastic investigation of crack-inclusion interaction. Experimental Mechanics 30(3):253–257
Savalia PC, Tippur HV (2007) A study of crack-inclusion interactions and matrix-inclusion debonding using Moire interferometry and finite element method. Experimental Mechanics 47(4):533–547
Kitey R, Tippur HV (2008) Dynamic crack growth past a stiff inclusion: Optical investigation of inclusion eccentricity and inclusion-matrix adhesion strength. Experimental Mechanics 48(1):37–53
Peters WH, Ranson WF (1982) Digital imaging techniques in experimental stress-analysis. Optical Engineering 21(3):427–431
Sutton MA, Wolters WJ, Peters WH, Ranson WF, McNeil SR (1983) Determination of displacements using an improved digital image correlation method. Image and Vision Computing 1(3):133–139
Bruck HA et al (1989) Digital image correlation using Newton-Raphson method of partial-differential correction. Experimental Mechanics 29(3):261–267
Reu PL, Miller TJ (2008) The application of high-speed digital image correlation. Journal of Strain Analysis for Engineering Design 43(8):673–688
Kirugulige MS, Tippur HV, Denney TS (2007) Measurement of transient deformations using digital image correlation method and high-speed photography: application to dynamic fracture. Applied Optics 46(22):5083–5096
Kirugulige MS, Tippur HV (2009) Measurement of Fracture Parameters for a Mixed-Mode Crack Driven by Stress Waves using Image Correlation Technique and High-Speed Digital Photography. Strain 45(2):108–122
Lee D et al (2009) Experimental Study of Dynamic Crack Growth in Unidirectional Graphite/Epoxy Composites using Digital Image Correlation Method and High-speed Photography. Journal of Composite Materials 43(19):2081–2108
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2013 The Society for Experimental Mechanics, Inc.
About this paper
Cite this paper
Jajam, K., Tippur, H. (2013). Interaction between a dynamically growing crack with stiff and compliant inclusions using DIC and high-speed photography. In: Proulx, T. (eds) Application of Imaging Techniques to Mechanics of Materials and Structures, Volume 4. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-9796-8_9
Download citation
DOI: https://doi.org/10.1007/978-1-4419-9796-8_9
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4419-9528-5
Online ISBN: 978-1-4419-9796-8
eBook Packages: EngineeringEngineering (R0)