Thermally Conductive Polymer Matrix Composites

Abstract

Thermally conductive polymer matrix composites are used increasingly for thermal management of electronic packaging system. The polymer matrix includes both thermosetting and thermoplastic types. Different kinds of fillers or reinforcements have been developed to process composite materials with desired thermal, mechanical, and electrical properties. Reinforcement fillers have an important role to play in maximizing polymer performance and production efficiency. Cost reduction, density control, optical effects, thermal conductivity, magnetic properties, flame retardancy, and improved hardness and tear resistance have been increased the demand for high-performance fillers. Several types of reinforcements, especially nanoparticulate fillers, have been used in polymer matrix composites: vapor grown carbon fiber (VGCF), carbon foam, carbon nanotube (CNT), and other thermal conductive particles, such as ceramic, carbon, metal or metal-coated particles, as well as metal or carbon foams. Nanoparticles of carbides, nitrides, and carbonitrides can be used to reinforce polymer matrix nanocomposites with desirable thermal conductivity, mechanical strength, hardness, corrosion, and wear resistance. To achieve these of desirable properties, however, polymer matrix and layout or distribution of reinforcements including nanoparticles need to be optimized. This chapter will give a brief review on the advanced thermally conductive polymer matrix composites, including polymer matrix types, reinforcement selection and its effect on thermal conductivity, fabrication and manufacturing process, and typical applications for thermal management of electronic packaging system.