Abstract
Interface delamination and popcorn cracking are among the most common reasons for mechanical damage in plastic packaging. Many investigations have shown the popcorn phenomenon to be a closely linked process of delamination of the pad/encapsulant interface, moisture diffusion, vapor pressure build-up, and popcorn cracking. A short survey on the phenomenon is given.
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© 2011 Springer-Verlag London Limited
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Dudek, R. (2011). Popcorn Cracking. In: Grossmann, G., Zardini, C. (eds) The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. Springer, London. https://doi.org/10.1007/978-0-85729-236-0_14
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DOI: https://doi.org/10.1007/978-0-85729-236-0_14
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