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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications pp 239–253Cite as

Modeling Superconformal Electrodeposition Using an Open Source PDE Solver

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Abstract

A critical aspect in the manufacturing of semiconductor devices is the filling of trenches and vias using metal electrodeposition. This filling process has been characterized extensively with semi-empirical mathematical and computational models, although much work is still required in order to employ less empirical models. However, these models have not been used in a predictive capacity in industry due to the time frame required for code development and experimental design and lack of available modeling software. To overcome these issues, an open source tool called FiPy [1] was developed for solving PDEs that commonly occur in materials science problems. It seeks to address the issues of coding practice and open source development by employing modern coding techniques and providing a flexible coding framework to rapidly pose, prototype, and share models of superfill and general deposition processes.

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Authors and Affiliations

  1. Materials Science and Engineering Laboratory, National Institute of Standards and Technology, 20899, Gaithersburg, MD, USA

    D. Wheeler & J.E. Guyer

Authors
  1. D. Wheeler
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  2. J.E. Guyer
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Correspondence to D. Wheeler .

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Editors and Affiliations

  1. Tel Aviv University, Ramat Aviv, Tel Aviv, 69978, Israel

    Yosi Shacham-Diamand

  2. Dept. Applied Chemistry, Waseda University, Okubo 3-4-1 , Tokyo, 169-8555, Japan

    Tetsuya Osaka

  3. Emerson Network Power, Cooligy Precision Cooling, Maude Avenue 800, Mountain View, 94043, U.S.A.

    Madhav Datta

  4. Division of Corporate Relations, The University of Tokyo, Hongo 7-3-1, Tokyo , 113-8654, Japan

    Takayuki Ohba

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Wheeler, D., Guyer, J. (2009). Modeling Superconformal Electrodeposition Using an Open Source PDE Solver. In: Shacham-Diamand, Y., Osaka , T., Datta, M., Ohba, T. (eds) Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. Springer, New York, NY. https://doi.org/10.1007/978-0-387-95868-2_16

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