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© 2009 Springer Science+Business Media, LLC
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(2009). Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages. In: Solder Joint Reliability Prediction for Multiple Environments. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-79394-8_9
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DOI: https://doi.org/10.1007/978-0-387-79394-8_9
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Publisher Name: Springer, Boston, MA
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Online ISBN: 978-0-387-79394-8
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