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Materials for Advanced Packaging pp 1–50Cite as

3D Integration Technologies – An Overview

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Abstract

The next generation of integrated micro-system technologies can only keep up with increased functionality and performance demands by using the 3rd dimension. The primary drivers for 3D integration are miniaturization, integration of different technologies in a small form-factor, and performance. 3D integration technologies can be grouped into 3 main categories, namely 3D On-chip integration, 3D IC-stacking, and 3D-packaging. This chapter provides a detailed review of each of these categories.

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  1. Sandia National Laboratories, Mail stop: 0352, Albuquerque, NM 87185

    Rajen Chanchani

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  1. Rajen Chanchani
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Correspondence to Rajen Chanchani .

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  1. Henkel Locite Co., Ltd. Yantai, Shandong, P.R., China

    Daniel Lu

  2. Georgia Institute of Technology, Atlanta, GA, USA

    C.P. Wong

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Chanchani, R. (2009). 3D Integration Technologies – An Overview. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_1

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