Abstract
This chapter gives an introduction to the future of electronic system integration as a combination of “More Moore” and “More than Moore” components, combined in one package (“system-in-package” or SiP). More Moore will very likely continue to be at the forefront of electronics development for the next decade. It is difficult, however, to integrate non-digital functions, such as sensors and power electronics, for example, monolithically with these technologies. For this reason the future belongs to integration technologies that combine several components into a highly integrated assembly in one package – “wafer-level packaging” processes, the use of ultrathin components, and multifunctional interposers will all play a key role in this context. Often two dimensions do no longer suffice. Because of signal propagation delays, wiring density, or confined available space many future applications require considerably more compact components. 3D integration can help overcome this bottleneck. Examples of 3D integration start with silicon 3D integration with through-silicon vias and go up to stacking of packages or modules at all technological levels. Functional packaging goes one step further. It takes the application system and its requirements as a starting point and then adapts the microelectronic functions.
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Reichl, H., Aschenbrenner, R., Töpper, M., Pötter, H. (2009). Heterogeneous Integration: Building the Foundation for Innovative Products. In: Zhang, G., Roosmalen, A. (eds) More than Moore. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-75593-9_9
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