Lead-free wave soldering is already in mass production in Asia and developing in Eastern Europe and the Americas, however lead-free wave is still the most challenging process to implement (together with lead-free BGA/CSP and PTH rework) and manufacturers around the world are challenged to qualify equipment and processes that will produce a quality lead-free product.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Friedrich J (2003) Practical experience in lead-free wave soldering, ERSA GmbH
Moon K-W, Boettinger WJ, Kattner UR, Biancaniello FS, Handwerker CA (2000) Experimental and thermodynamics assessment of SnAgCu alloys, J. Electron. Mater., Vol. 29, p1122-1236
Lee N-C, Reflow soldering processes and troubleshooting SMT, BGA, CSP and Flip-Chip Technologies, Newnes, 12-253
Sweatman K (2005) Another chance for tin-copper as a lead-free solder. APEX Special Issue, p 4-7
Nimmo K (2003) Second European Lead-free Soldering Technology Roadmap, Soldertec at Tin Technology Ltd, p11-12
Seelig K (1998) A comparison of leading lead-free alloys, AIM information,Volume & Issue1, http://www.aimsolder.com/technical_articles.cfm#17
Alpha Metals, Vaculoy SACX0307, Lead-free solder wave alloy technical bulletin, US Patent 4929423
Seelig K (2005) Considerations for lead-free wave soldering AIM information, http://www.aimsolder.com/technical_articles
Morris J, O’Keefe M J (2004) Equipment impact of lead-free wave soldering, Appliance Magazine
Shea C, Barton B, Belmonte J, Kirby K (2005) Practical lead-free implementation, http://www.speedlinetech.com/docs/Practical-LF-Implementation.pdf
Couderc J-F (2005) Solectron France lead-free wave soldering internal report
Alpha Vaculoy SAC300, 305, 400, 405 Ultra low lead free wave solder alloy, Cookson Electronics, Alpha Technical bulletin
Barbini D, Wang P (2005) Implementing lead-free wave soldering iNEMI, Printed Circuit Design and Manufacture.
J-STD-002B Standard (2003) Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Wang X, Poon C (2003) Benchmarking of lead-free no-clean fluxes soldering performance on OSP boards, SMTAI Conf Proceedings, Rosemont, USA
Kester VOC free flux technical bulletin
Gyemant T (2004) Lead-free wave soldering: a cost-effective alternative, SMT Articles
Wable GS, Chada S, Neal B, Fournelle RA (2005) Solidification shrinkage defects in electronic solders, Journal Of Materials, Vol. 57, no. 6, p38-42
IPC-A-610D Standard (2005) Acceptability of Electronics Assemblies
Faure C (2005) Lead-free Assembly: Process Considerations, IPC /Soldertec conference, Barcelona, Spain
Zetech (2005) Analyzing lead-free soldering defects in wave soldering using Taguchi methods, Dataweek-Electronics & Communications Technology
Bath J, Hueste G (2001) Lead-free Sn3.5Ag and Sn0.7Cu Wave Solder Evaluation with VOC-Free No-Clean and Water Soluble Fluxes, Nepcon East Conference, Boston, USA
Diepstraten G (2006) Matte or dull joints are normal and should be considered just an effect, Circuit Assembly magazine
BE95 (1994) IDEALS, BRITE-EURAM program, Synthesis report
Handwerker C (2002) NIST Research in Lead-Free Solders: Properties, Processing, Reliability, UC Smart
Havia E, Montonen H, Bernhardt E, Alatalo M (2005) Comparing SAC and SnCuNi solders in lead-free wave soldering process, NEXT Symposium, Finland.
Schouten G, Pad lifting, fillet lifting and fillet tearing issues in lead-free soldering, Vitronics-Soltec Technical White Paper
Ueshima M, Nodera M, Tajika T (2006) Mechanism of shrinkage cavities and method for restricting them in SnAgCu alloy system IPC-Soldertec conference on lead-free electronics, Malmö, Sweden
Sweatman K, Nishimura T, Jost J (2006) Solidification behaviour of the Ni-modified Sn0.7Cu eutectic, IPC-Soldertec conference on lead-free electronics, Malmö, Sweden
Handwerker CA, Noctor D, Whitten G (2000) Current assessment of the reliability of lead-free solders
Diepstraten G, The Range and Causes of Lead-Free Soldering Defects, Vitronics-Soltec Technical White Paper
Long G (2006) Lead-free surface finish overview, Intel Lead Free Symposium Sponsored by IPC, Scottsdale, Arizona, USA
Holder H, Billaut F (2006) OSP as a Pb-free surface finish at HP, Intel Lead Free Symposium Sponsored by IPC, Scottsdale, Arizona, USA
Ferrer E, Benedetto E, Freedman G, Billaut F, Holder H, Gonzalez D (2006) Reliability of Partially Filled SAC305 Through Hole Joints, IPC Printed Circuits Expo, APEX and the Designers Summit
Biocca P (2005) Lead-free reliability-building it right the first time, Kester, http://www.emsnow.com
Boone L, Campbell GP, Palacio LC (2005) Lead-free solder alloy selection: reliability is a key, SMT
Hillman D, Wilcox R (2006) JCAA/JG-PP No-Lead Solder Project:-55° C to +125°C Thermal Cycle Testing Final Report Revision B, Rockwell Collins Advanced Manufacturing Technology Group
NCMS Report 0401RE96 Pb-free Solder Project Final Report, (1997) National Center for Manufacturing Sciences
Faure C, Elkins M, Willie D, Zhou X, Lamb M, Chatterji I, Mainwaring S, Bath J Lead-free Pin Through Hole Reliability (2006), Solectron Internal Report
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Faure, C., Bath, J. (2007). Lead-Free Wave Soldering. In: Bath, J. (eds) Lead-Free Soldering. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-68422-2_4
Download citation
DOI: https://doi.org/10.1007/978-0-387-68422-2_4
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-32466-1
Online ISBN: 978-0-387-68422-2
eBook Packages: EngineeringEngineering (R0)