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RF MEMS Switches and Integrated Switching Circuits pp 229–264Cite as

Surface Planarization Process

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Part of the book series: MEMS Reference Shelf ((MEMSRS,volume 5))

Abstract

Surface planarization process is discussed in this chapter. Compared to bulk micromachining process, surface micromachining process is more suitable for the fabrication of capacitive switches. It is always important to planarize the sacrificial layer under the metal bridges to achieve flat metal bridges. Besides surface planarization, surface roughness is another important consideration to improve the intimate contact between the metal bridges and the dielectric layer when the metal bridges are driven down. Detailed discussion will be given in this chapter.

Aibin Yu and Ai Qun Liu

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    Aibin Yu and Ai Qun Liu

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Authors and Affiliations

  1. School of Electrical & Electronic Engineering, Nanyang Technological University, Nanyang Avenue, Singapore, 639798, Singapore

    Dr. Ai Qun Liu

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  1. Dr. Ai Qun Liu
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Correspondence to Ai Qun Liu .

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Liu, A.Q. (2010). Surface Planarization Process. In: RF MEMS Switches and Integrated Switching Circuits. MEMS Reference Shelf, vol 5. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-46262-2_10

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  • DOI: https://doi.org/10.1007/978-0-387-46262-2_10

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-46261-5

  • Online ISBN: 978-0-387-46262-2

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