Abstract
Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature.
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References
F. Ren, J. W. Nah, K. N. Tu, B. S. Xiong, L. H. Xu, and J. Pang, “Electromigration induced ductile-to-brittle transition in Pb-free solder joints,” Appl. Phys. Lett., 89 141914 (2006).
J.-W. Nah, F. Ren, K.-W. Paik, and K. N. Tu, “Effect of electromigration on mechanical shear behavior of flip chip solder joints,” J. Mater. Res., 21, 698–702 (2006).
J. M. Holt (Ed.), “Charpy Impact Test: Factors and Variables,” ASTM STP 1072, Philadelphia, PA (1990).
T. Shoji, K. Yamamoto, R. Kajiwara, T. Morita, K. Sato, and M. Date, Proceedings of the 16th JIEP Annual Meeting, 2002, p. 97.
M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, “Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test,” Scr. Mater., 51, 641(2004).
M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, “Impact reliability of solder joints,” Proceedings of the 54th ECTC, Las Vegas, NV, June 2004, pp. 668–674.
S. Ou, Y. Xu, K. N. Tu, M. O. Alam, and Y. C. Chan, “A study of impact reliability of lead-free BGA balls on Au/electrolytic Ni/Cu bond pad,” MRS 2005 Spring Meeting Proceedings, Symposium B, 10.5.
M. Alajok, L. Nguyen, and J. Kivilakti, “Drop test reliability of wafer level chip scale packages,” IEEE 2005, Electronic Components and Technology Conference, pp. 637–643.
E. H. Wong, Y.-W. Mai, and S. K. W. Seah, “Board level drop impact—fundamental and parametric analysis,” Trans. ASME, 127, 496–502 (2005).
E. H. Wong and Y.-W. Mai, “New insight into board level drop impact,” Microelectron Reliab., 46, 930–938 (2006).
M. Roseau, “Vibrations in Mechanical System,” pp. 111–136, Springer-Verlag, Berlin 1987.
L. Meirovitch, “Fundamentals of Vibrations,” pp. 14–39, McGraw–Hill Higher Education, New York (2001).
W. Goldsmith, “Impact: The Theory and Physical Behavior of Colliding Solids,” Edward Arnold Publishers, London (1960).
J. J. Tuma, “Handbook of Physical Calculations,” 2nd Enlarged & Revised Ed., pp. 311–312, McGraw–Hill, New York (1983).
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Tu, KN. (2007). Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_11
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DOI: https://doi.org/10.1007/978-0-387-38892-2_11
Publisher Name: Springer, New York, NY
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