Abstract
Solder has been used to join copper pipes for plumbing in every modern house and to join copper wires for circuitry connection in every electrical product. Solder joints are ubiquitous. The essential process in solder joining is the chemical reaction between copper and tin to form intermetallic compounds having a strong metallic bonding. After the iron–carbon (Fe-C) binary system, copper–tin (Cu-Sn) may be the second most important metallurgical binary system that has impacted human civilization, as suggested by the bronze (Cu-Sn alloy) age.
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Tu, KN. (2007). Introduction. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_1
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DOI: https://doi.org/10.1007/978-0-387-38892-2_1
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