Abstract
This paper gives an overview of the use of poly(ferrocenylsilane)s in the surface patterningof silicon substrates. Due to the presence of iron and silicon in their main chain, poly(ferrocenylsilane)sshow a very high resistance to reactive ion etching, allowing one to transfer polymer patternsdirectly onto the substrate. Methods for introducing etch-resistant polymer patterns on substratesurfaces include soft lithography approaches such as microcontact printing, directed dewetting, andcapillary force lithography. Next to top-down methods, self-assembly strategies are discussed. Phaseseparation in thin films of asymmetric organic–organometallic block copolymers leads to theformation of nanoperiodic organometallic patterns. The use of such thin films as nanolithographictemplates is demonstrated. Surface patterning can also be realized using electrostatic self-assemblyof organometallic polyions. Layer-by-layer deposition of poly(ferrocenylsilane) polyanions and polycationson chemically patterned substrates allows one to guide the growth of multilayer thin films and toproduce patterned organometallic coatings.
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Acknowledgments
This work was supported in part by the European Community's Human Potential Programme under contract HPRN-CT-1999-00151, [PolyNano].
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Korczagin, I., Lammertink, R.G.H., Hempenius, M.A., Golze, S., Vancso, G.J. (2005). Surface Nano- and Microstructuring with Organometallic Polymers. In: Vancso, G.J. (eds) Ordered Polymeric Nanostructures at Surfaces. Advances in Polymer Science, vol 200. Springer, Berlin, Heidelberg. https://doi.org/10.1007/12_038
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