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Materials for Information Technology pp 61–68Cite as

Pushing PVD to the Limits — Recent Advances

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Part of the book series: Engineering Materials and Processes ((EMP))

Conclusion

PVD deposition served well and will continue to serve metallization of advanced copper low-k interconnects in sub 100-nm-dimensions. How long? As long as better, more robust and more economical solutions emerge that can be integrated, provide performance and are reliable.

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Author information

Authors and Affiliations

  1. IMEC, Leuven, Belgium

    Zs. Tőkei

Authors
  1. Zs. Tőkei
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Editor information

Editors and Affiliations

  1. Materials Analysis Department, AMD Saxony Limited Liability Company & Co. KG, Wilschdorfer Landstraße 101, D-01109, Dresden, Germany

    Ehrenfried Zschech (Dr. rer. nat.) (Dr. rer. nat.)

  2. IMEC, Kapeldreef 75, B-3001, Leuven, Belgium

    Caroline Whelan Ph.D.

  3. Flash Technology Predevelopment, Infineon Technologies SC300, Königsbrücker Straße 180, D-01099, Dresden, Germany

    Thomas Mikolajick (Dr.-Ing.) (Dr.-Ing.)

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© 2005 Springer-Verlag London Limited

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Tőkei, Z. (2005). Pushing PVD to the Limits — Recent Advances. In: Zschech, E., Whelan, C., Mikolajick, T. (eds) Materials for Information Technology. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/1-84628-235-7_6

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  • DOI: https://doi.org/10.1007/1-84628-235-7_6

  • Publisher Name: Springer, London

  • Print ISBN: 978-1-85233-941-8

  • Online ISBN: 978-1-84628-235-5

  • eBook Packages: EngineeringEngineering (R0)

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