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Interconnect Technology — Today, Recent Advances and a Look into the Future

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Materials for Information Technology

Part of the book series: Engineering Materials and Processes ((EMP))

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References

  1. International Technology Roadmap for Semiconductors (ITRS), Semiconductor International Association, http://public.itrs.net/ (2003)

    Google Scholar 

  2. M. Engelhardt, G. Schindler, K. Mosig, G. Steinlesberger, W. Steinhögl, G. Gebara, Advanced Metallization Conference, Proc. AMC 2001, p. 11, (2001)

    Google Scholar 

  3. G. Steinlesberger, G. Schindler, M. Engelhardt, W. Steinhögl, M. Traving, International Interconnect Technology Conference, IITC 2004, Proceedings, p.51, (2004)

    Google Scholar 

  4. G. Schindler, W. Steinhögl, G. Steinlesberger, M. Traving, M. Engelhardt, Microelectron. Eng., 70/1, 7–12 (2003)

    Article  Google Scholar 

  5. W. Steinhögl, G. Schindler, G. Steinlesberger, M. Engelhardt, Phys. Rev. B 66, p. 075414 (2002)

    Article  Google Scholar 

  6. K. Fuchs, Proc. Cambridge Philos. Soc. 34, 100 (1938)

    Article  Google Scholar 

  7. E.H. Sondheimer, Adv. Phys. 1, 1 (1952)

    Article  MATH  Google Scholar 

  8. A.F. Mayadas and M. Shatzkes, Phys. Rev. B 1, 1382 (1970)

    Article  Google Scholar 

  9. G. Schindler, W. Steinhögl, G. Steinlesberger, M. Traving, M. Engelhardt, Advanced Metallization Conference, Proc. Vol., AMC 2002, p. 13 (2002)

    Google Scholar 

  10. G. Steinlesberger, A. von Glasow, M. Engelhardt, G. Schindler, W. Hönlein, M. Holz et al., International Interconnect Technology Conference, IITC 2002, Proceedings, p. 265 (2002)

    Google Scholar 

  11. M. Traving, G. Schindler, G. Steinlesberger, W. Steinhögl, M. Engelhardt Advanced Metallization Conference, Proc. AMC 2002, p. 753, (2002)

    Google Scholar 

  12. M. Traving, W. Steinhögl, G. Schindler, G. Steinlesberger, M. Engelhardt, Advanced Metallization Conference, Proc. AMC 2003, p. 391, (2003)

    Google Scholar 

  13. W. Steinhögl, G. Schindler, Advanced Metallization Conference, Proc. AMC 2001, p. 393, (2001)

    Google Scholar 

  14. Z. Gabric, W. Pamler, G. Schindler, W. Steinhögl, M. Traving, International Interconnect Technology Conference, IITC 2004, Proc. p. 151, (2004)

    Google Scholar 

  15. P. Kapur, G. Chandra, S. Souri, K. Saraswat, SEMICON West 2002, SEMI Technical Symposium (STS), Semiconductor Equipment and Materials International, p. 159 (2002)

    Google Scholar 

  16. K.K. O, K. Kim, B. Floyd, J. Mehta, H. Yoon, C.-M. Hung et al., International Interconnect Technology Conference, IITC 2003, Proc., (2003)

    Google Scholar 

  17. W. Hoenlein, F. Kreupl, G.S. Duesberg, A.P. Graham, M. Liebau, R. Seidel et al., Mater. Sci. and Eng. C 23, 663, (2003)

    Article  Google Scholar 

  18. A. M. Cassell et al., J. Am. Chem. Soc. 121, p. 7975 (1999)

    Article  Google Scholar 

  19. S. J. Tans et al., Nature, 393, 49, May 1998

    Article  Google Scholar 

  20. C. Zhou et al., Nature, 290, 1552 (2000)

    Google Scholar 

  21. www.techonline.com/community/news/14441

    Google Scholar 

  22. www.golem.de/0402/29811.html

    Google Scholar 

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Author information

Authors and Affiliations

  1. Infineon Technologies, Corporate Research, Munich, Germany

    M. Engelhardt, G. Schindler, W. Steinhögl, G. Steinlesberger & M. Traving

Authors
  1. M. Engelhardt
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  2. G. Schindler
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  3. W. Steinhögl
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  4. G. Steinlesberger
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  5. M. Traving
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Editor information

Editors and Affiliations

  1. Materials Analysis Department, AMD Saxony Limited Liability Company & Co. KG, Wilschdorfer Landstraße 101, D-01109, Dresden, Germany

    Ehrenfried Zschech (Dr. rer. nat.) (Dr. rer. nat.)

  2. IMEC, Kapeldreef 75, B-3001, Leuven, Belgium

    Caroline Whelan Ph.D.

  3. Flash Technology Predevelopment, Infineon Technologies SC300, Königsbrücker Straße 180, D-01099, Dresden, Germany

    Thomas Mikolajick (Dr.-Ing.) (Dr.-Ing.)

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© 2005 Springer-Verlag London Limited

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Engelhardt, M., Schindler, G., Steinhögl, W., Steinlesberger, G., Traving, M. (2005). Interconnect Technology — Today, Recent Advances and a Look into the Future. In: Zschech, E., Whelan, C., Mikolajick, T. (eds) Materials for Information Technology. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/1-84628-235-7_19

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  • DOI: https://doi.org/10.1007/1-84628-235-7_19

  • Publisher Name: Springer, London

  • Print ISBN: 978-1-85233-941-8

  • Online ISBN: 978-1-84628-235-5

  • eBook Packages: EngineeringEngineering (R0)

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