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Brenner A., Electrodeposition of Alloys, Principles and Practice, Vol.1, New York: Academic Press, 1963.
Ilyushenko L.F. Elektroliticheski Osazhdenie Magnitnie Plenki, Minsk: Nauka i Tekhnika, 1979.
Dahms H., Croll I.M. The Anomalous Codeposition of Iron-Nickel Alloys. J. Electrochem. Soc. 1965; 112:771–775.
Horkans J.. Effect of Plating Parameters on Electrodeposited NiFe. J. Electrochem. Soc. 1981; 128:45–49.
Matlosz M. Competitive Adsorption Effects in the Electrodeposition of Iron-Nickel Alloys. J. Electrochem. Soc. 1993; 140:2272–2279.
Vaes J., Franser J., Celis J.P. The Role of Metal Hydroxides in NiFe Deposition. J. Electrochem. Soc. 2000; 147:3718–3724.
Djokič S.S., Maksimović M.D.. “Electrodeposition of Nickel-Iron Alloys” In Modern Aspects of Electrochemistry, Vol. 22, pp. 417–466, J.O’M. Bockris, B.E. Conway and R.E. White, eds., New York: Plenum Press 1992.
Podlaha E.J., Landolt D. Induced Codeposition. J. Electrochem. Soc. 1996; 143:885–892.
Chassaing E., Quang K.Vu., Wiart R.. Mechanism of Nickel-Molybdenum Alloy Electrodeposition in Citrate Electrolytes. J. Appl. Electrochem. 1989; 19:839–843.
Djokič S.S. Electrodeposition of Amorphous Alloys Based on the Iron Group of Metals. J. Electrochem. Soc. 1999; 146:1824–1828.
Haseeb A.S.M.A., Celis J.P., Ross J.R. Dual-bath Electrodeposition of Cu/Ni Compositionally Modulated Multilayers. J. Electrochem. Soc. 1994; 141:230–237.
Rousseau A., Benabeu P. Single-bath Electrodeposition of Chromium-Nickel Compositionally Modulated Multilayers (CMM) from a Trivalent Chromium Bath. Plat. And Surf. Finish. 1999; 86(9):106–110.
Kelly J.J., Bradley P.E., Landolt D. Additive Effects During Pulsed Deposition of Cu-Co Nanostructures, J. Electrochem. Soc. 2000; 147:2975–2980.
Landolt D. Electrochemical and Materials Science Aspects of Alloy Deposition. Electrochim. Acta. 1994; 39:1075–1090.
Ying R. Electrodeposition of Copper-Nickel Alloys from Citrate Solutions on Rotating Disk Electrode. I Experimental Results. J. Electrochem. Soc. 1988; 135:2957–2964.
Hovestad A., Janssen L.J.J., Electrochemical Codeposition of Inert Particles in a Metallic Matrix. J. Appl. Electrochemistry. 1995; 25:579–527.
Buelens C., Celis J.P., Roos J.R. Electrochemical Aspects of the Codeposition of Gold and Copper with Inert Particles. J. Appl. Electrochem. 1983; 13:541–548.
Hwang B. J. Hwang C. S. Mechanism of Codeposition of Silicon Carbide with Electrolytic Cobalt. J. Electrochem. Soc. 1993; 140:979–984.
Guglielmi N. Kinetics of the Deposition of Inert Particles from Electrolytic Baths. J. Electrochem. Soc. 2000; 119:1009–1012.
Celis J., Roos J. R.. Kinetics of the Deposition of Alumina Particles from Copper Sulfate Plating Baths. J. Electrochem. Soc. 1977; 124:1508–1511.
Nowak P., Socha R.P., Kaisheva M., Fransaer J., Celis J. P., Stoinov Z., Electrochemical Investigation of the Codeposition of SiC and SiO 2 Particles with Nickel. J. Appl. Electrochem. 2000; 30:429–437.
Musiani M., Electrodeposition of Composites: An Expanding Subject in Electrochemical Materials Science. Electrocim. Acta 2000; 45:3397–3402.
Chen C.C., Bose C.S.C., Rajeshwar K.. The Reduction of Oxygen and Oxidation of Hydrogen at Polypyrrole Film Electrodes Containing Nanodispersed Platinum Particles. J. Electroanal. Chem. 1993; 350:161.
Alonso-Vante N., Cattarin C., Musiani M. Electrocatalysis of O 2 Reduction at Polyaniline + Molybdenum-Doped Ruthenium Selenide Composite Electrodes. J. Electroanal. Chem. 2000; 481:200–207.
Beck F., Dahlhaus F., Zahedi N. Anodic Codeposition of Polypyrrole and Dispersed TiO 2 . Electrochim. Acta. 1992; 37:1265.
Beck F., Dahlhaus M. Anodic Formation of Polypyrrole/Tungsten Trioxide Composites. J. Appl. Electrochem. 1993; 23:781.
Li H.S., Josowicz M., Baer D.R., Engelhard M.H., Janata J. Preparation and Characterization of Polyaniline-Palladium Composite Films, J. Electrochem. Soc. 1995; 142:798–805.
Hapel M. The Electrolytic Oxidation of Methanol at Finely Dispersed Platinum Nanoparticles in Polypyrrole Films. J. Electrochem. Soc, 1998; 145:124–134.
Musiani M. Anodic Deposition of PbO 2 /Co 3 O 4 Composites and Their Use as Electrodes for Oxygen Evolution reaction. J. Chem. Soc. Commun. 1996; 21:2403–2404.
Cattarin S., Frateur I., Guerriero P., Musiani M. Electrodeposition PbO 2 +CoO x of Composites by Simultaneous Oxidation of Pb 2+ and Co 2+ and Their Use as Anodes for Oxygen Evolution. Electrochim. Acta. 2000; 45:2279–2288.
Musiani M., Guerriero P. Electrodeposited Tl 2 O 3 -Matrix Composites I: Effect of the Dispersed Phase on Nucleation and Growth of the Matrix. J. Electrochem. Soc. 1998; 145:549–554.
Musiani M.M., Furlanetto F., Guerriero P. Electrodeposited Tl 2 O 3 -Matrix Composites II Electrocatalysis of Oxygen Evolution reaction on Tl 2 O 3 /Co 3 O 4 Composites. J. Electrochem. Soc. 1998; 145:555–560.
Kulesza P.S., Grzybowska B., Malik M.A., Galkowski M.T. Tungsten Oxides as Active Supports for Highly Dispersed Platinum Microcenters: Electrocatalytic Reactivity Toward Reduction of Hydrogen Peroxide and Oxygen. J. Electrochem. Soc. 1997; 144:1911–1917.
Spencer L.F.. Modern Electroforming. I Requirements and Mandrels. Metal Finishing. 1973; February:64–72.
Wearmouth W.R. Applications and Developments in Nickel Electroforming and Toolmaking. Metal Finishing. 1980; November:35–39.
Mehdizadeh S., Dukovic J., Andricacos P.C., Romankiw L.T., Cheh H. Y. The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects. J. Electrochem. Soc. 1993; 140:3497–3505.
Romankiw L.T. Electroforming of Electronic Devices. Plat. And Surf. Finish. 1997; 84(1):10–15.
Brenner A. “Electrolysis of Nonaqueous Systems.” In Advances in Electrochemistry and Electrochemical Engineering. C.W. Tobias, ed. Vol. 5: pp.205–248. New York: Interscience Publishers, 1967
Popovych O., Tomkins R.P.T., Nonaqueous Solution Chemistry, New York: John Wiley & Sons, 1981.
Lowenheim F. A., Modern Electroplating, Third Edition, New York: John Wiley & Sons, 1974.
Capuano G.A., Davenport W.G. Electrodeposition of Aluminum from Alkylbenzebe Electrolytes. J. Electrochem. Soc. 1971; 118:1688–1695.
Capuano G.A., Davenport W.G. Cathodic Polarization of Aluminum in Alkylbenzene Electrolytes. J. Electrochem. Soc. 1984; 131:2595–2600.
Biallazor S. Lisowska-Oleksiak A. The Modification of Aromatic Electrolytes for Electrodeposition of Aluminum. J. Appl. Electrochem. 1990; 20:590–595.
Mc Chesney M. Electrodeposited Aluminum. Plating and Surface Finishing. 1995; 82(10):42.
Safranik W.H., The Properties of Elctrodeposited Metals and Alloys, Second Edition, Orlando, FL: American Electroplaters and Surface Finishers Society, 1986.
Wilkes J.S., Levisky J.A., Wilson R.A., Hussey C.L. Dialkylimidazolium Chloroaluminate Melts: A New Class of Room temperature Ionic Liquids for Electrochemistry, Spectroscopy and Synthesis. Inorg. Chem. 1982; 21:1263–1265.
Lin Y.F., Sun I.W. Electrodeposition of Zinc from a Mixture of ZincChhloride and Neutral Aluminum-Chloride-1-Methyl-3-Ethylimidazolium Chloride Molten Salt. J. Electrochem. Soc. 1999; 146:1054–1059.
Moffat T.P. Electrodeposition of Al-Cr Metallic Glasses. J. Electrochem. Soc. 1994; 141:L115–L117.
Mitchell J.A., Pitner W.R., Hussey C.L.. Stafford G.R. Electrodeposition of Cobalt and Cobalt-Aluminum Alloys from a Room temperature Chloroaluminate Molten Salt. J. Electrochem. Soc. 1996; 143:3448–3455.
Pitner W.R., Hussey C.L. Electrodeposition of Zinc from the Lewis Acid Aluminum Chloride-1-Methyl-3Ethylimidazolium Chloride Room Temperature Molten Salt. J. Electrochem. Soc. 1997; 144:3095–3103.
Lee J.J., Bae I.T., Sherson D.A., Miller B., Wheeler K.A. Underpotential Deposition of Aluminum and Alloy Formation on Polycrystalline Gold Electrode from AlCl 3 /EMIC Room Temperature Molten Salts. J. Electrochem. Soc. 2000; 147:562–566.
Chen P.Y., Lin M.C., Sun I.W. “Electrodeposition of Cu-Zn Alloy from Acidic ZnCl 2 -EMIC Molten Salt”, J. Electrochem. Soc. 2000; 147:3350–3355.
Landolt D. Fundamental Aspects of Electropolishing. Electrochim. Acta. 1987; 32:1–11.
Mathieu J.B., Mathieu H. J., Landolt D. Electropolishing of Titanium in Perchloric Acid-Acetic Acid Solution. I. Auger Spectroscopy Study of Anodic Film, J. Electrochem. Soc. 1978; 125:1039–1043.
Mathieu J. B., Landolt D. Electropolishing of Titanium in Perchloric Acid-Acetic Acid Solution. II. Polarization and Stoichiometry. J. Electrochem. Soc. 1978; 125:1044–1049.
Piotrowski O., Mandore C., Landolt D., Electropolishing of Tantalum in Sulfuric Acid-Methanol Electrolyte. Electrochim. Acta. 1999; 44:3389–3399.
Sautebin R., Landolt D. Anodic Leveling Under Secondary and Tertiary Current Distribution Conditions, J. Electrochem. Soc., 1982; 129:946–953.
Vidal R., West A.C., Copper Electropolishing in Concentrated Phosphoric Acid, J. Electrochem. Soc. 1995; 142:2682–2694.
Novak M., Reddy A. K. N., Wroblowa H. An Ellipsometric Study of Surface Films on Copper Electrodes Undergoing Electropolishing. J. Electrochem. Soc. 1970; 117:733–737.
Glarum S.H., Marshall J.H. The Anodic Dissolution of Copper into Phosphoric Acid. I. Voltammetric and Oscillatory Behavior. J. Electrochem. Soc. 1985; 132:2872–2878.
Datta M., Landolt D. On the Influence of Electrolyte Concentration, pH and Temperature on Surface Brightening of Nickel Under ECM Conditions. J. Appl. Electrochem. 1997; 7:247–252.
Datta M, Landolt D., On the Role of Mass Transport in High Rate Dissolution of Iron and Nickel in ECM Electrolytes-II. Chlorate and Nitrate Solutions. Electrochim. Acta. 1980; 25:1263–1271.
Datta M., Shenoy R.V., Romankiw L.T. Recent Advances in the Study of Electrochemical Manufacturing. Journal of Engineering for Industry, 1996; 118(2):29.
Jain V.K., Dixit P.M., Pandey P.M. On the Analysis of the Electrochemical Spark Machining Process. International Journal of Machine Tools and Manufacturing, 1999; 39(1): 165.
Ni X, Mc Geough J.A., Greated C.A. A Study of Electrical Discharges in Electrolyte by High Speed Photography. J. Electrochem. Soc. 1993; 140(12):3505–3512.
Butterfield D, Sgarzi A. Method and Apparatus for Electrochemical Machining of Spray Holes in Fuel Injection. US Patent, 5,026,462 (1991).
Finneran M.T., Finneran R.J. Electromyographic Electrode. U.S. Patent, 6,047,202 (2000).
Neufeld P., Ali H.O. The Influence of Anions on the Structure of Porous Anodic Al 2 O 3 Films Grown in Alkaline Electrolytes. J. Electrochem. Soc. 1973; 120:479–484.
Farnann I., Durpee R., Jeong Y., Thompson G.E., Wood G.C., Forty A. Structural Chemistry of Anodic Alumina. Thin Solid Films. 1989; 173:209–215.
Thompson G.E., Fumeaux R.C., Goode J.S., Wood G. C. Porous Anodic Films Formation on Aluminum Substrates in Phosphoric Acid. Trans. Inst. Met. Finish. 1978; 56:159–167.
Patermarakis G., Moussoutzanis K. Mathematical Models for the Anodization Conditions and Structural Features of Porous Anodic Al 2 O 3 Films on Aluminum. J. Electrochem. Soc. 1995; 142:737–743.
Patermarakis G. Development of a Theory for the Determination of the Composition of the Anodizing Solution Inside the Pores During the Growth of Porous Anodic Al 2 O 3 Films on Aluminum by a Transport Phenomenon Analysis. J. Electroanal. Chem., 1998; 447:25–41.
Patermarakis G., Papandreadis N., Effect of the Structure of Porous Anodic Al 2 O 3 Films on the Mechanism of Their Hydration and Pore Closure During Hydrothermal Treatment. Electrochim. Acta. 1993; 38:1413–1418.
Patermarakis G., Karayannis H.S. The Mechanism of Growth of Porous Anodic Al 2 O 3 Films on Aluminum at High Film Thickness. Electrochim. Acta. 1995; 40:2647.
Young L., Anodic Oxide Films, London: Academic Press, 1961.
Brace A.W., Sheasby P.G., The Technology of Anodizing Aluminum., Stonehouse, Glos. Technology Limited,, 1979.
Henley V.F., Anodic Oxidation of Aluminum and its Alloys, Oxford: Pergamon Press, 1982.
Mansfeld F., Zhang G., Chen C., Evaluation of Sealing Methods for Anodized Aluminum Alloys with Electrochemical Impedance Spectroscopy (EIS), Plat. and Surf. Finish., 1997; 84(12):72–81.
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(2002). Electroplating and Surface Finishing. In: Fundamental Aspects of Electrometallurgy. Springer, Boston, MA. https://doi.org/10.1007/0-306-47564-2_9
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