Abstract
In electroless copper deposition with formaldehyde the anodic and cathodic partial reactions are strongly coupled. This nonlinear behavior may lead to local fluctuations of the deposition rate. We use in-situ scanning tunneling microscopy for the determination of local deposition rates. From the images and from single scan lines it can be seen that the deposition rate fluctuates locally and with time. These fluctuations do only occur during electroless deposition, in contrast to galvanic deposition, where all crystallites grow with the same, constant rate.
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© 2002 Kluwer Academic Publishers
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Weber, C.J., Pickering, H.W., Weil, K.G. (2002). Local Rate of Electroless Copper Deposition By Scanning Tunneling Microscopy. In: Cohen, S.H., Lightbody, M.L. (eds) Atomic Force Microscopy/Scanning Tunneling Microscopy 3. Springer, Boston, MA. https://doi.org/10.1007/0-306-47095-0_11
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DOI: https://doi.org/10.1007/0-306-47095-0_11
Publisher Name: Springer, Boston, MA
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