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Pressure-induced H-transfers in the networks of hydrogen bonds

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Book cover Frontiers of High Pressure Research II: Application of High Pressure to Low-Dimensional Novel Electronic Materials

Part of the book series: NATO Science Series ((NAII,volume 48))

Abstract

Structure-property relations for the H-bonded compounds conform to the strict rules governing the interactions in solids and their thermodynamic characteristics These rules allow one to predict the behaviour of protons as a function of thermodynamic conditions, like temperature or pressure, and to obtain from structural data the quantitative information about possible transformations of the crystals These in turn, can be applied for designing the crystals with the properties optimized for technological applications, such as computer memory devices or low-dimensional conductors

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Author information

Authors and Affiliations

  1. Faculty of Chemistry, Adam Mickiewicz University, Grunwaldzka 6, 60-780, Poznan, Poland

    A. Katrusiak

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  1. A. Katrusiak
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Editor information

Editors and Affiliations

  1. Department of Physics, Colorado State University, Fort Collins, CO, USA

    Hans D. Hochheimer

  2. Institute of Physical and Theoretical Chemistry, Wroclaw University of Technology, Wroclaw, Poland

    Bogdan Kuchta

  3. Department of Chemistry, Colorado State University, Fort Collins, CO, USA

    Peter K. Dorhout

  4. Department of Chemistry, University of Wyoming, Laramie, WY, USA

    Jeffery L. Yarger

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© 2001 Springer Science+Business Media Dordrecht

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Katrusiak, A. (2001). Pressure-induced H-transfers in the networks of hydrogen bonds. In: Hochheimer, H.D., Kuchta, B., Dorhout, P.K., Yarger, J.L. (eds) Frontiers of High Pressure Research II: Application of High Pressure to Low-Dimensional Novel Electronic Materials. NATO Science Series, vol 48. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0520-3_6

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  • DOI: https://doi.org/10.1007/978-94-010-0520-3_6

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-0160-4

  • Online ISBN: 978-94-010-0520-3

  • eBook Packages: Springer Book Archive

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