Abstract
Thermal stability in datacenter’s computing units is fundamental to ensure reliability, and durability of the equipment, besides, environmental concern and new regulations require a reduction of the power used. For these reasons, a novel energy neutral hybrid cooling system is proposed. We describe the design, and the prototype’s performance evaluated both in passive and active cooling modes. During normal operating conditions, the thermo-electric energy harvesting system transforms wasted heat into electric energy, and stores it in super-capacitors while the system is providing passive cooling. Active cooling can be activated when a boost in performance requires CPU overclocking, using free energy from the passive step. After the choice of the most suitable harvesting system we designed and tested the prototype on an ARM based CPU, the future core of low-power server architectures. The proposed governor switches to active cooling mode based on customizable thermal management policies. Experimental results demonstrate good passive cooling performance, and several minutes active cooling exploiting the recovered heat.
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References
Choi, K., Soma, R., Pedram, M.: Dynamic voltage and frequency scaling based on workload decomposition. In: Proceedings of the 2004 International Symposium on Low Power Electronics and Design, 2004. ISLPED ’04, pp. 174–179 (2004)
Murali, S. et al.: Temperature control of high-performance multi-core platforms using convex optimization. In: Proceedings of the Conference on Design, Automation and Test in Europe, DATE ‘08, ACM, pp. 110–115 (2008)
Merritt, R.: Dell, IBM give thumbs up to ARM Servers. In: EE Times (2010)
Data Centre Specialist Group: Meeting the energy efficiency and financial challenges in it. Technical report, BCS (2007)
Suski, E.D.: Method and apparatus for recovering power from semiconductor circuit using thermoelectric device, 30 May 1995. US Patent 5,419,780
Solbrekken, G. et al.: Experimental demonstration of thermal management using thermoelectric generation. In: ITHERM ‘04. The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 284–290 (2004)
Wu, C.-J.: Architectural thermal energy harvesting opportunities for sustainable computing. Comput. Architect. Lett. (2013)
Rizzon, L., Rossi, M., Passerone, R., Brunelli, D.: Wireless sensor networks for environmental monitoring powered by microprocessors heat dissipation. In: Proceedings of the 1st International Workshop on Energy Neutral Sensing Systems, ENSSys ‘13. ACM (2013)
Rossi, M., Rizzon, L., Fait, M., Passerone, R., Brunelli, D.: Energy neutral wireless sensing for server farms monitoring. IEEE J. Emerg. Sel. Top. Circuits Syst. 4(3), 324–335 (2014)
Prijic, A., Vracar, L., Vuckovic, D., Milic, D., Prijic, Z.: Thermal energy harvesting wireless sensor node in aluminum core PCB technology. IEEE Sens. J. 15(1), 337–345 (2015)
Kiflemariam, R., Lin, C.-X.: Numerical simulation and parametric study of heat-driven self-cooling of electronic devices. J. Therm. Sci. Eng. Appl. ASME 7 (2015)
Rizzon, L., Rossi, M., Passerone, R., Brunelli, D.: Self-powered heat-sink SoC as temperature sensors with wireless interface: design and validation. In Proceedings of IEEE Sensors 2014, (2014)
Laird Technologies: Thermoelectric Handbook
Acknowledgments
This work is supported by the European FP7 Project Green Data Net, grant n. 609000. http://www.greendatanet-project.eu/
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Rossi, M., Rizzon, L., Fait, M., Passerone, R., Brunelli, D. (2016). Self-powered Active Cooling System for High Performance Processors. In: De Gloria, A. (eds) Applications in Electronics Pervading Industry, Environment and Society. Lecture Notes in Electrical Engineering, vol 351. Springer, Cham. https://doi.org/10.1007/978-3-319-20227-3_4
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DOI: https://doi.org/10.1007/978-3-319-20227-3_4
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