Summary
The domain decomposition method is directed to electronic packaging simulation in this article. The objective is to address the entire simulation process chain, to alleviate user interactions where they are heavy to mechanization by component approach to streamline the model simulation process.
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© 2005 Springer-Verlag Berlin Heidelberg
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Chow, P., Lai, CH. (2005). Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition. In: Barth, T.J., et al. Domain Decomposition Methods in Science and Engineering. Lecture Notes in Computational Science and Engineering, vol 40. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-26825-1_16
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DOI: https://doi.org/10.1007/3-540-26825-1_16
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-22523-2
Online ISBN: 978-3-540-26825-3
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