Abstract
Optical fibers are one of the most commonly used light transmitting media in optoelectronic systems for telecommunication applications. Because the core diameter of optical fibers is very small, active alignment methods are usually employed for the coupling between optical fibers and other optoelectronic devices. In general, the equipment cost of active alignment is very high and the processing time is relatively long, especially for fiber array alignment. Therefore, the conventional fiber alignment process becomes rather expensive and the throughput is quite low. In recent years, passive alignment using low cost epoxy adhesives and precisely etched V-grooves on silicon optical benches is attracting more attention due to its reduced production cost and short processing time. During the passive alignment process, the optical fiber may be lifted up by the buoyancy of epoxy flow and, hence, an extra cover plate is required to press the fiber against the walls of the V-groove. An effort is made to develop a modified passive alignment method without using the cover plate. Several parameters may affect the yield and need to be optimized. It is found that the amount of epoxy dispensed to the V-groove is critical in the process. Also the viscosity of the epoxy determines the characteristics of the flow in the V-groove and, hence, affects the results of passive alignment. In this chapter, the design and configuration of the modified passive alignment method will be introduced. The effect of the volume and viscosity of epoxy will be presented. The application to multiple fiber alignment will be demonstrated. The newly developed passive alignment method is capable of aligning an array of 8 fibers up to 1 micron accuracy.
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References
M.F. Dautartas, J. Fisher, H. Luo, P. Datta, and A. Jeantilus, Hybrid optical packaging, challenges and opportunities, Proc. 52nd ECTC, San Diego, CA, May 2002, pp. 787–793.
M.W. Beranek, et al., Passive alignment optical sub-assemblies for military/aerospace fiber-optic transmitter/ receiver modules, IEEE Transactions on Advanced Packaging, 23(Aug.), pp.461–469 (2000).
G. Keiser, Optical Fiber Communications, McGraw-Hill, New York, 2000.
D.K. Mynbaev and L.L. Scheiner, Fiber-Optic Communications Technology, Prentice Hall, New Jersey, 2001.
R.R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, New York, 2001.
F.G. Smith and T.A. King, Optics and Photonics, John Wiley & Sons, Chichester, 2000.
J.A. Buck, Fundamentals of Optical Fibers, John Wiley & Sons, Chichester, 1995.
P. Karioja, et al., Comparison of active and passive fiber alignment techniques for multimode laser pigtailing, Proc. 50th ECTC, Las Vegas, ND, May 2000, pp. 244–248.
S.H. Law, T.N. Phan, and L. Poladian, Fibre geometry and pigtailing, Proc. 51st ECTC, Orlando, FL, May 2001, pp. 1447–1450.
K. Ishikawa, An integrated micro-optical system for laser-to-fiber active alignment, Proc. IEEE 15th MEMS, Jan. 2002, pp. 491–494.
J. Goodrich, A silicon optical bench approach to low cost high speed transceivers, Proc. 51st ECTC, Orlando, FL, May 2001, pp. 238–241.
R. Hauffe, U. Siebel, K. Petermann, R. Moosburger, J.-R. Kroop, and F. Arndt, Methods for passive fiber chip coupling of integrated optical devices, IEEE Transactions on Advanced Packaging, 24(Nov.), pp. 450–455 (2001).
R.A. Boudreau, Passive alignment in optoelectronic packaging, Optical Fiber Communication, OFC 97, Feb. 1997, pp. 109–110.
S.J. Park, et al., A novel method for fabrication of a PLC platform for hybrid integration of an optical module by passive alignment, IEEE Phton. Technol. Lett., 14(Apr.), pp. 486–488 (2002).
H. Mori, et al., LD and PD array modules assembled in a new plastic package with auto-alignment projections for silicon optical bench, Pro. OFC/IOOC, 3(Feb.), pp. 198–200 (1999).
G. Grand and C. Artigue, Hybridization of optoelectronic components on silicon substrate, Proc. ECOC’94, 1994, pp. 193–200.
R. Moosburger, B. Schüppert, U. Fischer, and K. Petermann, Passive alignment technique for all-silicon integrated optics, Proc. Integr. Photon. Res., Boston, MA, IWH3, Apr. 1996, pp. 565–568.
R. Moosburger, R. Hauffe, U. Siebel, D. Arndt, J. Kropp, and K. Petermann, Passive alignment of single mode fibers to integrated polymer waveguide structures utilizing a single mask process, IEEE Photon. Technol. Lett., 11, pp. 848–850 (1999).
M.W. Beranek, et al., Passive alignment optical sub-assemblies for military/aerospace fiber-optic transmitter/receiver modules, IEEE Trans. Advanced Packaging, 23(Aug.), pp. 461–469 (2000).
M.F. Grant, et al., Self-aligned multiple fibre coupling for silica-on-silicon integrated optics, Proc. 9th Annual European Fibre Optic Conference, London, UK, Jun. 1991, pp. 269–272.
J.W. Osenbach, et al., Low cost/high volume laser modules using silicon optical bench technology, Proc. IEEE 48th ECTC, May 1998, pp. 581–587.
K. Kurata, et al., A surface mount single-mode laser module using passive alignment, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 19(3), pp. 524–531 (1996).
K. Yamauchi, et al., Automated mass production line for optical module using passive alignment technique, Proc. 50th ECTC, Las Vegas, ND, May 2000, pp. 15–20.
C.B. Probst, A. Bjarklev, and S.B. Andreasen, Experimental verification of microbending theory using mode coupling to discrete cladding modes, 7(Jan.), pp. 55–61 (1989).
C. Unger and W. Stocklein, Investigation of the microbending sensitivity of fibers, Journal of Lightwave Theory, 12(Apr.), pp. 591–596 (1994).
J.C.C. Lo and S.W.R. Lee, Experimental assessment of passive alignment of optical fibers with V-groove on silicon optical bench, Proc. 6th EPTC, Singapore, December 2004, pp. 375–380.
J. Lo, R. Lee, S. Lee, J.S. Wu, and M. Yuen, Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves, Proc. IEEE 54th ECTC, Jun. 2004, pp. 830–834.
J. Lo, C.S. Yung, R. Lee, S. Lee, J.S. Wu, and M. Yuen, Passive alignment of optical fiber in V-groove with low viscosity epoxy flow, Proc. ASME IMECE, Nov. 2003, paper IMECE 2003/43902.
K.E. Bean, Anisotropic etching of silicon, IEEE Trans Electron Devices, ED-25, pp. 1185–1193 (1978).
C.W. Chang and W.F. Hsieh, Micromachined double-side 45° silicon reflectors for dual-wavelength DVD optical pickup heads, Proc. IEEE 54th ECTC, Jun. 2004, pp. 1390–1395.
C. Strandman, et al., Fabrication of 45° mirrors together with well-defined v-grooves using wet anisotropic etching of silicon, Journal of Microelectromechanical System, 4(Dec.), pp. 213–219 (1995).
S.A. Campbell and H.J. Lewerenz, Semiconductor Micromaching Volume 1 Fundamental Electrochemistry and Physics, John Wiley & Sons, Chichester, 1998.
S.A. Campbell and H.J. Lewerenz, Semiconductor Micromaching, Volume 2, Techniques and Industrial Applications, John Wiley & Sons, Chichester, 1998.
E. Bassous, Fabrication of novel three-dimensional microstructures by the anisotropic etching of (100) and (110) silicon, IEEE Trans Electron Devices, ED-25, pp. 1178–1185 (1978).
M. Sekimura, Anisotropic etching of surfactant-added TMAH solution, Proc. IEEE 12th MEMS, Jan. 1999, pp. 650–655.
W. Sonphao and S. Chaisirikul, Silicon anisotropic etching of TMAH solution, Proc. IEEE ISIE, Jun. 2001, pp. 2049–2052.
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Ricky Lee, S.W., Lo, C.C. (2007). Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow. In: Suhir, E., Lee, Y.C., Wong, C.P. (eds) Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Springer, Boston, MA. https://doi.org/10.1007/0-387-32989-7_26
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DOI: https://doi.org/10.1007/0-387-32989-7_26
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