About this book series

The Springer Series in Advanced Microelectronics provides systematic information on all the topics relevant for the design, processing, and manufacturing of microelectronic devices. The books, each prepared by leading researchers or engineers in their fields, cover the basic and advanced aspects of topics such as wafer processing, materials, device design, device technologies, circuit design, VLSI implementation, and sub-system technology. The series forms a bridge between physics and engineering, therefore the volumes will appeal to practicing engineers as well as research scientists.
Electronic ISSN
2197-6643
Print ISSN
1437-0387
Series Editor
  • Kiyoo Itoh,
  • Thomas H. Lee,
  • Rino Micheloni,
  • Takayasu Sakurai,
  • Willy M. C. Sansen,
  • Doris Schmitt-Landsiedel,
  • Souvik Mahapatra

Book titles in this series

  1. 3D Microelectronic Packaging

    From Architectures to Applications

    Editors:
    • Yan Li
    • Deepak Goyal
    • Copyright: 2021

    Available Renditions

    • Hard cover
    • Soft cover
    • eBook

Abstracted and indexed in

  1. SCImago
  2. SCOPUS