Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

Editors:

ISBN: 978-90-481-3805-0 (Print) 978-90-481-3807-4 (Online)
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Table of contents (24 chapters)

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  1. Front Matter

    Pages i-x

  2. MEMS/NEMS Technologies and Applications

    1. Front Matter

      Pages 1-1

    2. Book Chapter

      Pages 3-15

      History of Early Research on MEMS in Russia (U.S.S.R.)

    3. Book Chapter

      Pages 17-30

      Challenges of Complete CMOS/MEMS Systems Integration

    4. Book Chapter

      Pages 31-40

      MEMS for Practical Applications

    5. Book Chapter

      Pages 41-65

      Nanochip: A MEMS-Based Ultra-High Data Density Memory Device

    6. Book Chapter

      Pages 67-74

      Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU

    7. Book Chapter

      Pages 75-87

      Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors

    8. Book Chapter

      Pages 89-100

      Monocrystalline-Silicon Microwave MEMS Devices

    9. Book Chapter

      Pages 101-113

      Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites

  3. MEMS Device and Reliability Physics

    1. Front Matter

      Pages 116-116

    2. Book Chapter

      Pages 117-128

      Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams

    3. Book Chapter

      Pages 129-140

      Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS

    4. Book Chapter

      Pages 141-153

      The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches

  4. Advanced Processes and Materials

    1. Front Matter

      Pages 156-156

    2. Book Chapter

      Pages 157-165

      Development of DRIE for the Next Generation of MEMS Devices

    3. Book Chapter

      Pages 167-178

      Low-Temperature Processes for MEMS Device Fabrication

    4. Book Chapter

      Pages 179-190

      High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications

    5. Book Chapter

      Pages 191-203

      3D Integration of MEMS and IC: Design, Technology and Simulations

    6. Book Chapter

      Pages 205-214

      Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices

    7. Book Chapter

      Pages 215-223

      Modeling of Dry Etching in Production of MEMS

    8. Book Chapter

      Pages 225-236

      XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures

    9. Book Chapter

      Pages 237-246

      Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys

  5. Sensors

    1. Front Matter

      Pages 248-248

    2. Book Chapter

      Pages 249-259

      Smart Sensors: Advantages and Pitfalls

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