Copper Electrodeposition for Nanofabrication of Electronics Devices

Editors:

ISBN: 978-1-4614-9175-0 (Print) 978-1-4614-9176-7 (Online)

Table of contents (12 chapters)

  1. Front Matter

    Pages i-viii

  2. Copper Electrodepositon and Additive Chemistry

    1. Front Matter

      Pages 1-1

    2. No Access

      Book Chapter

      Pages 3-25

      Copper Electrodepositon

    3. No Access

      Book Chapter

      Pages 27-43

      Supression Effect and Additive Chemistry

    4. No Access

      Book Chapter

      Pages 45-61

      Acceleration Effect

    5. No Access

      Book Chapter

      Pages 63-95

      Modeling and Simulation

  3. Copper on Chip Metallization

    1. Front Matter

      Pages 97-97

    2. No Access

      Book Chapter

      Pages 99-113

      Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

    3. No Access

      Book Chapter

      Pages 115-130

      Microstructure Evolution of Copper in Nanoscale Interconnect Features

    4. No Access

      Book Chapter

      Pages 131-173

      Direct Copper Plating

  4. Through Silicon Via and Other Methods

    1. Front Matter

      Pages 171-171

    2. No Access

      Book Chapter

      Pages 177-192

      Through Silicon Via

    3. No Access

      Book Chapter

      Pages 193-227

      Build-up Printed Wiring Boards (Build-up PWBs)

    4. No Access

      Book Chapter

      Pages 229-265

      Copper Foil Smooth on Both Sides for Lithium-Ion Battery

    5. No Access

      Book Chapter

      Pages 267-282

      Through Hole Plating

  5. No Access

    Book Chapter

    Pages E1-E1

    Erratum to: Acceleration Effect